Microelectronic package and method of manufacturing same
OwnerAbhishek Gupta, Zhiyong Wang +1inventors
InventorsAbhishek Gupta, Zhiyong Wang, Chuan Hu
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Abstract
A microelectronic package comprises a substrate (110), a die (120) having a front side (121) and a back side (122) located over the substrate, a thermally conducting layer (130) on the back side of the die, a microchannel (140) above the thermally conducting layer, and a cap (150) on the microchannel. The thermally conducting layer between the die and the microchannel may lend mechanical strength to the package, may be thin enough to be compliant and avoid contributing meaningful CTE mismatch with the die, and may prevent the formation or propagation of cracks in the microchannel.
Claims15
A microelectronic package comprising:
- a substrate;
- a die having a front side and a back side located over the substrate;
- a thermally conducting layer on the back side of the die;
- a microchannel above the thermally conducting layer;
- and
- a cap on the microchannel.
A method of manufacturing a microelectronic package, the method comprising:
- providing a substrate, a die having a front side and a back side, and a microchannel;
- depositing a thermally conducting layer on the back side of the die;
- bonding the die and the microchannel to each other;
- placing a cap on the microchannel;
- and
- attaching the die to the substrate.
Dependencies are inferred from the claim text.