Method of fabricating CMOS image sensor
AssigneeDongbu Electronics Co., Ltd.
InventorYong Suk Lee
Life of this patent
Estimating the term…
Abstract
A method of fabricating a CMOS image sensor is provided, in which a trapezoidal microlens pattern profile is formed to facilitate reflowing the microlens pattern and by which a curvature of the microlens may be enhanced to raise its light-condensing efficiency. The method includes forming a plurality of photodiodes on a semiconductor substrate; forming an insulating interlayer on the semiconductor substrate including the photodiodes; forming a protective layer on the insulating interlayer; forming a plurality of color filters corresponding to the photodiodes; forming a top coating layer on the color filters; forming a microlens pattern on the top coating layer; and forming a plurality of microlenses by reflowing the microlens pattern.
Claims19
A CMOS image sensor, comprising:
- a plurality of photodiodes on or in a semiconductor substrate;
- an insulating layer on the semiconductor substrate including the photodiodes;
- a color filter layer on the insulating layer, the color filter layer comprising a plurality of color filters, each color filter comprising a plurality of indented portions on a plurality of boundaries thereof;
- and
- a plurality of microlenses on the color filter layer, each of the plurality of microlenses corresponding to a unique photodiode.
Dependencies are inferred from the claim text.