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US 2008/0277683 A1Published application
Soldering method for semiconductor optical device, and semiconductor optical device
AssigneeAsahi Rubber Inc.
InventorsMasutsugu Tasaki, Kenichi Ozawa
Life of this patent
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Abstract
A method for soldering a semiconductor optical device including a resin-made optical lens to an object by a reflow soldering process using a lead-free solder, and a semiconductor optical device for use in the method. A semiconductor optical device including a silicone resin-made optical lens as the resin-made optical lens is used;
Claims22
A method for soldering a semiconductor optical device comprising a resin-made optical lens comprising:
- providing an object comprising a printed circuit board;
- applying a lead-free solder on said object;
- mounting leads of the semiconductor optical device on the solder area;
- and
- reflowing said lead-free solder by heating said object as whole or the solder area,
- wherein said resin-made optical lens comprises a silicone resin-made optical lens, and
- said silicone resin-made optical lens has a Shore D hardness of 20 to 90 measured by a method according to JIS K 7215.
4 more elements
A semiconductor optical device comprising a resin-made optical lens to be soldered to a printed circuit board by a reflow soldering process using a lead-free solder,
- wherein the resin-made optical lens is a silicone resin-made optical lens, and the silicone resin-made optical lens has a Shore D hardness of 20 to 90 measured by a method according to JIS K 7215.
Dependencies are inferred from the claim text.