Cavity exploration with an image sensor

A method of manufacturing a cavity exploration device, the method comprising:

• forming a plurality of through-holes in an integrated circuit, each through-hole associated with a respective conductive pad on a surface of the integrated circuit;
• mounting an image sensor on the integrated circuit;
• and
• for each of a corresponding plurality of insulated micro-cables,
• positioning the micro-cable in a corresponding through-hole in the plurality of through-holes such that an uninsulated portion of the micro-cable aligns with the respective conductive pad;
• soldering the uninsulated portion of the micro-cable to the respective conductive pad to form a solder joint;
• gluing the micro-cable to the integrated circuit;
• and
• covering exposed uninsulated portions of the micro-cable adjacent to the solder joint with a resin.

A system to explore cavities, the system comprising:

• an integrated circuit support having a plurality of through-holes;
• an image sensor coupled to the integrated circuit support;
• a plurality of pairs of bonding pads associated with respective through-holes in the plurality of through-holes;
• a plurality of micro-cables passing through respective through-holes in the plurality of through-holes, each micro-cable in the plurality of micro-cables soldered and glued to a respective pair of bonding pads of the plurality of bonding pads to form respective solder joints;
• a first layer of resin on a first side of the integrated circuit support configured to cover electrically conductive surfaces associated with the solder joints on the first side of the integrated circuit support;
• and
• a second layer of resin on a second side of the integrated circuit support configured to cover electrically conductive surfaces associated with the solder joints on the second side of the integrated circuit support.

An endoscope, comprising:

• an integrated circuit support having a plurality of through-holes;
• an image sensor coupled to the integrated circuit support;
• a light-emitting diode coupled to the integrated circuit support;
• a plurality of pairs of bonding pads associated with respective through-holes in the plurality of through-holes;
• a plurality of micro-cables passing through respective through-holes in the plurality of through-holes, each micro-cable in the plurality of micro-cables soldered and glued to a respective pair of bonding pads of the plurality of bonding pads to form respective solder joints;
• a first layer of resin on a first side of the integrated circuit support configured to cover electrically conductive surfaces associated with the solder joints on the first side of the integrated circuit support;
• and
• a second layer of resin on a second side of the integrated circuit support configured to cover electrically conductive surfaces associated with the solder joints on the second side of the integrated circuit support.