Semiconductor device, method of manufacturing the same, electro-optic device and electronic apparatus
AssigneeSeiko Epson Corporation
InventorTakayuki Kondo
Life of this patent
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Abstract
The invention provides a semiconductor device, a method of manufacturing the same, an electro-optic device and an electronic apparatus which are capable of addressing or solving a problem of mechanical mounting of a semiconductor element chip on a substrate. A semiconductor device includes a tile-shaped microelement bonded to a substrate, and an insulating functional film provided to cover at least a portion of the tile-shaped microelement.
Claims5
A method of manufacturing a semiconductor device, comprising:
- forming a semiconductor element on a surface of a semiconductor substrate;
- separating a functional layer which is a surface layer of the semiconductor substrate and which includes the semiconductor element, to form a tile-shaped microelement;
- bonding the tile-shaped element to a surface of another substrate;
- forming an insulating protective film having a barrier property against oxygen and moisture to cover at least a portion of the tile-shaped microelement;
- and
- bonding the semiconductor element of the tile-shaped microelement that is bonded to the other substrate to a circuit formed on the other substrate.
A method of manufacturing a semiconductor device, comprising:
- forming a semiconductor element on a surface of a semiconductor substrate;
- bonding a film to the surface of the semiconductor substrate on which the semiconductor element is formed;
- separating only a functional layer which is a surface layer of the semiconductor substrate and which includes the semiconductor element, to form a tile-shaped microelement;
- bonding the tile-shaped microelement to a surface of another substrate;
- forming an insulating protective film having a barrier property against oxygen and moisture to cover at least a portion of the tile-shaped microelement;
- and
- bonding the semiconductor element of the tile-shaped microelement that is bonded to the other substrate to a circuit formed on the other substrate.
A method of manufacturing a semiconductor device that comprises a substrate;
- a tile-shaped microelement bonded to the substrate;
- and an insulating protective film having a barrier property against oxygen and moisture, the insulating protective film provided to cover at least a portion of the tile-shaped microelement, in which the functional film covers the tile-shaped microelement in a sealed state, the method comprising:
- forming a semiconductor element on a surface of a semiconductor substrate;
- separating a functional layer which is a surface layer of the semiconductor substrate and which includes the semiconductor element, to form a tile-shaped microelement;
- bonding the tile-shaped element to a surface of another substrate;
- and
- forming an insulating protective film having a barrier property against oxygen and moisture to cover at least a portion of the tile-shaped microelement, further including bonding the semiconductor element of the tile-shaped microelement that is bonded to the other substrate to a circuit formed on the other substrate.
Dependencies are inferred from the claim text.