Process for making stubless printed circuit boards

A printed circuit board comprising:

• at least one embedded copper interconnect line and two external insulating layers opposite one another,
• wherein each of the external insulating layers include an external interconnect line disposed within the external insulating layer, and the embedded interconnect line and the external interconnect lines intersect a common through-hole;
• an inner seed layer disposed in the common through-hole from the embedded interconnect line to one of the two external interconnect lines,
• wherein the insulator diameter of the through-hole is substantially equal throughout, and an outermost surface of the through-hole proximate to one of the two external insulating layers of the printed circuit board consists essentially of an insulating surface.

A printed circuit board comprising:

• at least two internal insulating layers and a plurality of copper interconnect lines embedded in the internal insulating layers;
• a plurality of through-holes comprising at least two copper lands, wherein each of the at least two copper lands is associated with at least two of the plurality of embedded copper interconnect lines;
• a copper conductor disposed between the copper lands, wherein the copper conductor comprises a first copper layer of electroless applied copper and a second copper layer of electrolytic plated copper, and
• two external insulating layers, wherein the insulator diameter of the through-hole of the external insulating layers is substantially equal to the insulator diameter of the through-hole between the embedded interconnect lines;
• and
• an interior surface of the through-hole associated with each external insulating layer that consists essentially of an insulating surface.

A printed circuit board comprising:

• at least one embedded copper interconnect line and at least one external copper interconnect line disposed within an external insulating layer, wherein the embedded interconnect line and the external interconnect line intersect a common through-hole;
• an inner seed layer disposed in the common through-hole from the embedded interconnect line to the external interconnect line,
• an opposite external insulating layer, wherein the insulator diameter of the through-hole of said opposite external insulating layer is substantially greater than the insulator diameter of the through-hole between the embedded interconnect line and external interconnect line;
• and
• an outermost surface of the through-hole proximate to the opposite external insulating layer of the printed circuit board consists essentially of an insulating surface.

A structure comprising:

• a plurality of electronic components;
• and
• a printed circuit board,
• wherein said plurality of electronic components are electronically connected to said printed circuit board,
• wherein said printed circuit board electrically interconnects said plurality of electronic components, and
• wherein said printed circuit board comprises:
• at least two copper interconnect lines separated by an insulator in a vertical direction;
• a through-hole provided in the printed circuit board in the vertical direction such that the at least two interconnect lines provide a copper land in the through-hole;
• a portion of an external insulating layer removed about a circumferential region of the through-hole;
• a seed layer applied to an interior surface of the through-hole;
• an outermost portion of the seed layer removed from the interior surface of the through-hole with a laser, and
• copper applied on the seed layer.

A process comprising:

• providing a plurality of electronic components,
• providing a printed circuit board;
• and
• disposing said plurality of electronic components in electrical connection to said printed circuit board to electronically interconnects said plurality of electronic components:
• wherein said printed circuit board comprises:
• at least two copper interconnect lines separated by an insulator in a vertical direction;
• a through-hole provided in the printed circuit board in the vertical direction such that the at least two interconnect lines provide a copper land in the through-hole;
• a portion of an external insulating layer removed about a circumferential region of the through-hole;
• a seed layer applied to an interior surface of the through-hole;
• an outermost portion of the seed layer removed from the interior surface of the through-hole with a laser;
• and
• copper applied on the seed layer.