Printed Circuit Board and Its Designing Method, and Designing Method of Ic Package Terminal and Its Connecting Method
AssigneePanasonic Corporation
InventorMasaki Watanabe
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Abstract
The invention provides a printed circuit board capable of mounting BGA or other IC package of narrow terminal interval by using through-holes of conventional size. On one principal surface of printed circuit board (1), soldering lands (2a), (2b), (2c), and (2d) for connecting solder balls are disposed in lattice. Central point (B) of through-hole (3) is set eccentric to the side of soldering land (2a) at the same potential as through-hole (3), remote from intersection (A) formed by diagonal line (200ab) linking soldering lands (2a) and (2b) and diagonal line (200cd) linking soldering lands (2c) and (2d).
Claims18
A printed circuit board mounting IC package having plural connection terminals arrayed in lattice, comprising:
- plural soldering lands for connecting connection terminals of the IC package, through-holes penetrating through the printed circuit board from one principal surface to other wiring layer, and through-hole upper lands larger in diameter than said soldering lands provided around the circumference of the same side as soldering lands out of the through-holes,
- wherein the through-holes surrounded by plural soldering lands are set eccentric to the soldering land side at same potential as connection with through-hole upper lands.
Dependencies are inferred from the claim text.