Electronic Assemblies without Solder and Methods for their Manufacture
AssigneeOccam Portfolio LLC
InventorJoseph C. Fjelstad
Life of this patent
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Abstract
The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702.
Claims23
A circuit assembly 400 comprising:
- a substrate 416,
- a component package 402 with one or more leads 412,
- an insulating material 404 attaching the component package 402 with the substrate 416;
- and
- at least one via 420 extending through the substrate 416 to the one or more leads 412.
A circuit assembly 400 comprising:
- a substrate 416 having a planar first side and a planar second side,
- a least one component 406 with a first set of one or more leads 412, the component 406 having at least two sides,
- a first electrically insulating material 404 attaching at least one of said two sides of the component 406 with said first planar side of said substrate 416, and
- at least one via 420 extending from the second planar side of the substrate 416 exposing the first set of one or more leads 412.
A circuit assembly 400 comprising:
- a substrate 416 having a planar first side and a planar second side,
- a least one component package 402 with a first set of one or more leads 412, the component package 402 having at least two sides;
- a first electrically insulating material 404 attaching at least one of the two sides of the component package 406 with the first planar side of the substrate 416, and
- at least one via 420 extending from the second planar side of the substrate 416 exposing the first set of one or more leads 412.
A method of making a circuit assembly comprising:
- placing 800 at least one component 406 on a substrate 808, the component 406 having at least two sides, the substrate 808 having a first planar side and a second planar side,
- incorporating 900 a first electrically insulating material 908, the insulating material 908 attaching at least one side of the at least one component 406 with the first planar side of the substrate 808, and
- forming 1000 a first set of at least one via 1002 through the second planar side of substrate 808 to expose a first set of at least one lead 412 of the at least one component 406.
A method of making a circuit assembly comprising:
- placing 800 at least one component package 802, 804, 806 on a substrate 808, the component package 802, 804, 806 having at least two sides, the substrate 808 having a first planar side and a second planar side,
- incorporating 900 a first electrically insulating material 908, the insulating material 908 attaching at least one side of the at least one component package 802, 804, 806 with the first planar side of the substrate 808, and
- forming 1000 a first set of at least one via 1002 through the second planar side of substrate 808 to expose a first set of at least one lead 1406 of the at least one component package 802, 804, 806.
Dependencies are inferred from the claim text.