US 2008/0260327 A1 · INTEGRATED CIRCUIT HAVING COMPACT HIGH-SPEED BUS LINES FOR OPTICAL SIGNAL

Abstract

An integrated circuit having compact high-speed bus lines consists of VCSEL Array providing optical fiber holes, PIN Array providing optical fiber holes, and multi-mode optical fiber with great diameter optical core, wherein the VCSEL Array providing optical fiber holes and the PIN Array providing optical fiber holes both utilize the microelectromechanical system (MEMC) technology to form optical fiber holes as a concentric cylinder shape with diameter 100 μm, height 30 μm and diameter 130 μm, height 80-100 μm in the VCSEL light emitting area and the PIN light receiving area, respectively. An integrated package can be easily accomplished by mechanically performing focusing package of fixed optic-insertion to complete a glued integrated package, and thereby the package cost as a majority of the prime cost can be greatly reduced.

Claims6

Dependent claims

An integrated circuit having compact high-speed optical-signal bus lines that employs optical fiber hole arrays to solve a technical bottleneck concerning optical-fiber package of array wafer for increasing the product yield and reducing the manufacturing cost so as to fabricate the integrated circuit having bus lines for optical-signal in a simple way, comprises:

a multi-mode optical fiber whose two ends are disposed into optical fiber holes, respectively;
a VCSEL array that couples with the optical fiber holes;
a PIN array that couples with another fiber hole;
and
the multi-mode optical fiber has an optical cores with a diameter of 100 micron-meter (μm).

2 more elements

Dependencies are inferred from the claim text.

Integrated circuit having compact high-speed bus lines for optical signal

Life of this patent

Integrated circuit having compact high-speed bus lines for optical signal

Life of this patent

Abstract

Claims6