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AssigneeTokyo Seimitsu Co., Ltd.
InventorsAkio Ishikawa, Shinji Ueyama
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In an image defect inspection method and apparatus, which detects a gray level difference between the corresponding portions of two images, automatically sets a threshold value based on the distribution of the detected gray level difference, compares the detected gray level difference with the threshold value, and judges one or the other of the portions to be defective if the gray level difference is larger than the threshold value, provisions are made to reduce the occurrence of false defects when there is a brightness difference between the two images undergoing the comparison. In the image defect inspection method, the brightness difference between the two images is computed (S106), and the threshold value is determined in such a manner that the threshold value increases with the computed brightness difference (S107).
An image defect inspection method which detects a gray level difference between corresponding portions of two images, changes a threshold value in accordance with the distribution of said detected gray level difference, compares said detected gray level difference with said threshold value thus determined, and judges one or the other of said portions to be defective if said gray level difference is larger than said threshold value, wherein
An image defect inspection apparatus comprising:
An appearance inspection apparatus for detecting a defect in a semiconductor circuit pattern formed on a semiconductor wafer, comprising:
Dependencies are inferred from the claim text.