Chip Module and Method for Producing a Chip Module
OwnerManfred Rietzlerinventor
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Abstract
The invention pertains to a chip module for producing contactless chip cards with a chip carrier that is provided with inner and outer contacts on a substrate, wherein the inner contacts are bonded to terminal areas of a chip unit arranged on the chip carrier and the outer contacts serve for being bonded to an antenna, and wherein the chip unit is accommodated in a sandwich-like fashion between the substrate and a fiber-reinforced cover layer such that the cover layer is connected to the substrate adjacent to at least two opposite lateral edges of the chip unit, as well as to a method for producing a chip module.
Claims20
A chip module for producing contactless chip cards comprising:
- a chip carrier having inner and outer contacts on a substrate, the inner contacts being bonded to terminal areas of a chip unit arranged on the chip carrier and the outer contacts being arranged for bonding to an antenna,
- the chip unit being arranged between the substrate and a fiber-reinforced cover layer such that the cover layer is connected to the substrate adjacent to at least two opposite lateral edges of the chip unit.
A method for producing a chip module with a chip carrier having inner and outer contacts on a substrate and a chip unit bonded to the inner contacts, the method further comprising:
- bonding terminal areas of the chip unit to the inner contacts of the chip carrier;
- applying a fiber-reinforced cover layer onto the chip unit such that the chip unit is arranged between the substrate and the cover layer;
- and
- connecting the cover layer to the substrate adjacent to at least two opposite lateral edges of the chip unit.
Dependencies are inferred from the claim text.