Magnetic disk drive and soldering method of feed-through

A magnetic disk drive, in which a base accommodates

• a disk,
• a spindle motor for rotationally driving the disk,
• a head for recording and reproducing information on the disk,
• a head gimbal assembly for moving the head to an optional position on the disk,
• an actuator assembly for driving the head gimbal assembly, and
• a flexible printed circuit (FPC) assembly for electrically connecting between the head, spindle motor, and actuator assembly, and
• a feed-through for electrical connection to the FPC assembly is mounted in the base, and
• the base is joined with a cover, so that a low-density gas is enclosed within the magnetic disk drive, characterized in that:
• the base has a stepped portion in the inside of a periphery of the opening, and
• films formed by plating or soldering are provided on the stepped portion of the base and a surface of the feed-through facing the base respectively,
• wherein when the stepped portion of the base is joined by soldering with the flange of the feed-through, a solder fillet is formed in both of the inside and the outside of the base.

A soldering method of the feed-through in a magnetic disk drive, in which a base accommodates

• a disk,
• a spindle motor for rotationally driving the disk,
• a head for recording and reproducing information on the disk,
• a head gimbal assembly for driving the head to an optional position on the disk,
• an actuator assembly for moving the head gimbal assembly,
• a flexible printed circuit (FPC) assembly for electrically connecting between the head, spindle motor, and actuator assembly,
• and a feed-through for electrical connection to the FPC assembly, and
• the base is joined with a cover, so that a low-density gas is enclosed within a spaced formed by the base and the cover, characterized in that:
• the base, and the feed-through positioned in an opening of the base in a noncontact manner are supported on a jig, and
• solder is supplied into a gap between the base and the feed-through,
• wherein the solder is melted so that the feed-through is joined to the base.