Semiconductor device
AssigneeNEC Electronics Corporation
InventorDaisuke EJIMA
Life of this patent
Estimating the term…
Abstract
A resin layer covering a semiconductor chip on a wiring board is composed of a first resin layer and a second resin layer, wherein the first resin layer and the second resin layer differ in their plan view pattern, satisfying a relation of a<b, where “a” is difference in length in the direction from the center of the board towards the edges between the first resin layer and the second resin layer, and “b” is difference in length in the direction from the center of the board towards the corners between the first resin layer and the second resin layer.
Claims9
A semiconductor device having a semiconductor chip connected to a board having terminal portions formed thereon, a first resin layer covering said semiconductor chip, and a second resin layer covering said first resin layer, wherein said first resin layer and said second resin layer differ in the plan view pattern, and satisfy a relation of a<b, where “a” is difference in length in the direction from the center of said board towards the edges between said first resin layer and said second resin layer, and “b” is difference in length in the direction from the center of said board towards the corners between said first resin layer and said second resin layer.
Dependencies are inferred from the claim text.