Cut-Out Heat Slug for Integrated Circuit Device Packaging

A heat slug comprising:

• a lower portion, the lower portion having a plurality of mounting feet;
• an upper portion, the upper portion having a cavity, the cavity of sufficient size to accommodate an integrated circuit device;
• a plurality of first-size openings, the plurality of first-size openings surrounding the IC device;
• a second-size opening, the second size opening constructed from one of the first-size openings, the second-size opening being larger than the first-size opening, the second-size opening facilitating the introduction of molding compound into the cavity of the heat slug.

A high performance ball grid array (HBGA) package structure, comprising:

• a substrate, the substrate having conductive traces, the traces having pad landings;
• an integrated circuit device (IC) mounted on the substrate, the IC having bonding pads;
• a plurality of conductive wires connecting the IC bonding pads with the pad landings connected to the traces;
• a heat slug having a predetermined height disposed on the surface of the substrate, the heat slug including
• a cavity to accommodate the IC device,
• a plurality of first-size openings, the plurality of first-size openings surrounding the IC device;
• a second-size opening, the second size opening constructed. from one of the first-size openings the second-size opening being larger than the first-size opening, the second-size opening facilitating the introduction of molding compound pinto the cavity of the heat slug;
• and
• a plurality of mounting feet the mounting feet providing mechanical attachment of the heat slug to the substrate, wherein the plurality of mounting feet further include additional mounting feet in the vicinity of the second size opening.

A method of bonding an integrated circuit die (IC) to a substrate, the method comprising:

• placing the IC on the substrate;
• attaching the IC to the substrate;
• wire bonding the IC to the substrate;
• disposing a heat slug over the IC and attaching the heat slug to the substrate, the heat slug including,
• a plurality of mounting feet, providing mechanical attachment of the heat slug to the substrate,
• a cavity to accommodate the IC device, and a plurality of first-size openings surrounding the IC;
• a second-size opening constructed from one off the first-size openings the second-size opening being larger than the first-size opening, the second-size opening facilitating the introduction of molding compound into the cavity of the heat slug;
• and
• injecting p molding compound into the second-size opening of the heat slug.