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US 2008/0258295 A1Published application
Self-Contained Cooling Mechanism for Integrated Circuit Using a Reversible Endothermic Chemical Reaction
AssigneeMayo Foundation for Medical Education and Research
InventorsWendy L. Wilkins, Barry K. Gilbert
Life of this patent
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Abstract
A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a working fluid including a chemical compound that reacts endothermically to absorb heat produced by the devices and releases the heat in a reverse reaction to the enclosure.
Claims20
A package for an electronic device which produces heat during its operation, which comprises:
- a substrate containing electrical conductors;
- means for mounting the electronic device to the substrate and electrically connecting it to the conductors therein;
- an enclosure disposed over the top surface of the substrate to font an enclosed space;
- and
- a working fluid disposed in the enclosed space and including a chemical compound that reacts endothermically to absorb heat produced by the electronic device and that reacts exothermically to release heat to the enclosure.
2 more elements
Dependencies are inferred from the claim text.