Semiconductor device package to improve functions of heat sink and ground shield
AssigneeAdvanced Chip Engineering Technology Inc.
InventorsWen-Kun YANG, Diann-Fang LIN
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Abstract
The present invention provides a package structure and a method for forming the same. The structure comprises a substrate with contact pads and through holes filled with conducting metals for performing heat dissipation and ground shielding A chip with bonding pads is attached on the contact pad by an adhesive with high thermal conductivity to achieve heat dissipation. A RDL is formed on the substrate and the chip to couple the bonding pad and the contact pad formed on the substrate. The structure of present invention can improve the thickness thereof, and the heat dissipation and ground shielding of the structure are enhanced. Furthermore, the structure can achieve package on package (PoP) structure.
Claims13
A package structure, comprising
- a substrate having a first contact pad and a through hole formed therein;
- a metal layer formed at a lower surface of said substrate and coupled to said first contact pads via said through hole for heat dissipation and ground shielding;
- a die with a bonding pad attached on said first contact pads by an adhesive with high thermal conductivity;
- a dielectric layer formed on said die and a second contact pad formed at an upper surface of said substrate;
- a redistribution layer (RDL) formed above said die and coupled to said bonding pad for electrical connection;
- and
- a solder ball formed on said second contact pad formed on said upper surface of said substrate.
A method for manufacturing a IC Device package structure, comprising providing a substrate with a first contact pad, a second contact pad and a through hole;
- dispensing an adhesive on the back side of a die with a bonding pad;
- attaching said die on said first contact pad;
- forming build up layer to couple said second pad with said boding pad;
- forming a top protection layer on said die and said substrate by coating or printing;
- placing a solder ball on said second contact pad;
- and
- reflowing said solder ball whereby forming said solder ball on said second contact pad.
Dependencies are inferred from the claim text.