Simplified Substrates for Semiconductor Devices in Package-on-Package Products

Abstract

An insulating sheet-like substrate (601), which has on one surface (601a) a first patterned metal layer (605) with a first (603a) and a second (603b) array of contact pads. The pads of the first array have a first pitch center-to-center, and each pad has a first perimeter. The pads of the second array have a second pitch center-to-center, and each pad has the first perimeter. The substrate has on its other surface (601b) a second patterned metal layer (606) with a third array (607) of contact pads, which has the first pitch center-to-center, and each pad has a third perimeter. Conductive vias (640) between the first and the second metal layers connect contact pads and have a fourth perimeter; the vias are placed in interstitial locations so that the fourth perimeter does not intersect with the first and third perimeters. Vias in interstitial locations can be provided by disposing the first array and the third array so that the first and third perimeters of respective contact pads are concentrically aligned.

Dependencies are inferred from the claim text.