Lead frame free package and method of making
OwnerHua Yang, Yong Liuinventors
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Abstract
A lead frame free packaged semiconductor device with an exposed heat sink is formed by die bonding the semiconductor device directly to the heat sink and bonding package leads directly to the semiconductor die, and optionally to the heat sink. In an alternative embodiment, a lead frame free packaged semiconductor device with an exposed heat sink is formed by die bonding the semiconductor device directly to the heat sink and wire bonding package leads to the semiconductor die, and optionally to the heat sink.
Claims30
A lead frame free packaged semiconductor die comprising:
- a) a heat sink plate with the semiconductor die bonded directly thereto;
- b) a plurality of package leads attached directly to said semiconductor die;
- and
- c) encapsulating material encapsulating a portion of said heat sink plate and said semiconductor die and a portion of each of said plurality of package leads.
A lead frame tree packaged semiconductor die comprising:
- a) a heat sink plate with the semiconductor die bonded directly thereto;
- b) a plurality of package leads wire bonded to said semiconductor die;
- and
- c) encapsulating material encapsulating a portion of said heat sink plate and said semiconductor die and a portion of each of said plurality of package leads.
A method of packaging a semiconductor die comprising the steps of:
- a) placing a heat sink plate in a recess in a panelized top jig;
- b) bonding a semiconductor die directly to said heat sink;
- c) placing a plurality of package leads in a like plurality of recesses in a panelized bottom jig with a first end of each of said plurality of package leads extends over another recess in said panelized bottom jig;
- d) applying solder paste to the tips of said first ends of said plurality of package leads;
- e) aligning and joining said panelized top jig and said panelized bottom jig such that said tips of said plurality of package leads are in contact with contacts on said semiconductor die;
- f) reflow soldering said joined panelized top and bottom jigs to form contacts between said semiconductor die and said plurality of package leads;
- g) removing said panelized top jig and placing a top molding plate on said panelized bottom jig;
- and
- h) encapsulating said semiconductor die and portions of said heat sink plate and said plurality of package leads.
A method of packaging a semiconductor die comprising the steps of:
- a) placing a heat sink plate in a first recess in a panelized top jig;
- b) bonding a semiconductor die directly to said heat sink;
- c) placing a plurality of package leads in a like plurality of additional recesses in said panelized top jig, a first end of each of said plurality of package leads extending over said first recess;
- d) wire bonding said first ends to said semiconductor die;
- e) placing a molding plate in contact with said panelized top jig;
- and
- f) encapsulating said semiconductor die and said wire bonds and portions of said heat sink plate and said plurality of package leads.
Dependencies are inferred from the claim text.