Semiconductor Package and Method
AssigneeInfineon Technologies AG
InventorsRichard Mangapul Sinaga, Najib Khan Surattee, Mohamad Yazid
Life of this patent
Estimating the term…
Abstract
A semiconductor package is disclosed. In one embodiment, the semiconductor package includes a leadframe including a chip position and a plurality of leadfingers. Each leadfinger includes a cutout in an inner edge providing a chip recess. The semiconductor package further includes a semiconductor chip located in the chip recess. The semiconductor chip has an active surface with a plurality of chip contact pads on each of which an electrically conductive bump is disposed. The inner portions of the leadfingers protrude into the chip position and are electrically connected to the chip contact pads by electrically conductive bumps.
Claims31
-30. (canceled)
A semiconductor package comprising:
- a leadframe including a chip position, and a plurality of lead fingers, each leadfinger having an inner portion and an outer portion;
- wherein each leadfinger includes a cutout in an inner edge providing a chip recess to accommodate a semiconductor chip, the chip recess having a base and side walls;
- and
- wherein the chip recess is laterally larger than the chip position, wherein the inner portions of the leadfingers protrude into the chip position and provide at least in part the base of the chip recess.
A semiconductor package comprising:
- a leadframe including a chip position, and a plurality of lead fingers, each leadfinger having an inner portion and an outer portion;
- wherein each leadfinger includes a cutout in an inner edge providing a chip recess to accommodate a semiconductor chip, the chip recess having a base and side walls;
- and wherein the chip recess is laterally larger than the chip position, wherein the inner portions of the leadfingers protrude into the chip position and provide at least in part the base of the chip recess;
- a semiconductor chip having an active surface with a plurality of chip contact pads and a passive surface;
- an electrically conductive bump disposed on each contact pad;
- and
- wherein the semiconductor chip is located in the chip recess, the inner portions of the leadfingers are positioned above the chip contact pads, and wherein the chip contact pads are electrically connected to the leadfingers by the electrically conductive bumps.
A method to produce a semiconductor package having a leadframe strip comprising:
- providing a metal foil;
- forming a plurality of package positions in the metal foil, adjacent package positions being mechanically connected by tie bars, wherein each package position includes:
- a chip position;
- a plurality of leadfingers, each leadfinger having an inner portion and an outer portion;
- providing a cutout in an inner edge of each leadfinger to provide a chip recess for accommodating a semiconductor chip, the chip recess having a base and side walls;
- and
- wherein the chip recess is laterally larger than the chip position and wherein the inner portions of the leadfingers protrude into the chip position and provide at least in part the base of the chip recess.
A method to assemble a semiconductor package comprising:
- providing a leadframe strip, including at least one leadframe comprising a leadframe including a chip position, and a plurality of leadfingers, each leadfinger having an inner portion and an outer portion;
- wherein each leadfinger includes a cutout in an inner edge providing a chip recess to accommodate a semiconductor chip, the chip recess having a base and side walls;
- wherein the chip recess is laterally larger than the chip position, wherein the inner portions of the leadfingers protrude into the chip position and provide at least in part the base of the chip recess;
- providing a semiconductor chip having an active surface with a plurality of chip contact pads and a passive surface;
- forming an electrically conductive bump on each chip contact pad;
- mounting the semiconductor chip in the chip recess, the inner portions of the leadfingers being positioned above the chip contact pads;
- and
- electrically connecting the chip contact pads to the leadfingers via the electrically conductive bumps.
Dependencies are inferred from the claim text.