Etched leadframe structure
AssigneeFairchild Semiconductor Corporation
InventorLay Yeap Lim
Life of this patent
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Abstract
A leadframe structure is disclosed. The leadframe structure includes a first leadframe structure portion with a first thin portion and a first thick portion, where the first thin portion is defined in part by a first recess. It also includes a second leadframe structure portion with a second thin portion and a second thick portion, where the second thin portion is defined in part by a second recess. The first thin portion faces the second recess, and the second thin portion faces the first recess.
Claims20
A leadframe structure comprising:
- a first leadframe structure portion comprising a first thin portion and a first thick portion, wherein the first thin portion is defined in part by a first recess;
- and
- a second leadframe structure portion comprising a second thin portion and a second thick portion, wherein the second thin portion is defined in part by a second recess;
- wherein the first thin portion faces the second recess, and the second thin portion faces the first recess.
The leadframe structure of 1 wherein the first recess and the second recess are formed by etching.
A semiconductor die package comprising:
- a leadframe structure comprising a first leadframe structure portion comprising a first thin portion and a first thick portion, wherein the first thin portion is defined in part by a first recess, wherein the first leadframe structure portion is a lead, and a second leadframe structure portion comprising a second thin portion and a second thick portion, wherein the second thin portion is defined in part by a second recess, and wherein the second leadframe structure portion is a die attach pad, wherein the first thin portion faces the second recess, and the second thin portion faces the first recess;
- a semiconductor die on the die attach pad;
- and
- a molding material formed around at least part of the leadframe structure and the semiconductor die.
A method for forming a leadframe structure, the method comprising:
- obtaining a leadframe structure precursor including a first leadframe structure portion and a second leadframe structure portion;
- forming a first recess in the first leadframe structure portion, whereby the first leadframe structure portion thereafter has a first thick portion and a first thin portion;
- forming a second recess in the second leadframe structure portion, whereby the second leadframe structure portion thereafter has a second thick portion and a first thin portion;
- wherein the first thin portion faces the second recess, and the second thin portion faces the first recess in the formed leadframe structure.
Dependencies are inferred from the claim text.