Split Chip

The system and method of one complete integrated circuit contained upon two independent pieces of silicon conductively connected by a fine piece of conductive material such as conductive ink;

• the method of fabricating one disintegrated silicon miniaturized circuit having a plethora and plurality of electrical components on two wafers of single crystal semi conductive material yet conductively connected to form one circuit, known as a bifurcated circuit;
• a plurality of transistors defined within the two silicon wafers with each transistor composed of semi conductive material of opposite conductivity types;
• a silicon antenna and passive transistor circuits etched on the detachable piece of silicon wafer;
• a memory circuit and active transistor section etched on the retained piece of silicon wafer;
• adjacent one major face of one wafer providing a base and an emitter region which overlie a collector region the base emitter and base collector regions of said transistors extending entirely to one major face;
• a plurality of thin elongated regions of the other wafer exhibiting substantial resistance to provide semi conductor resistors;
• the retained wafer spaced on said one major face of the transistors to form memory circuits;
• the antenna, resistors, capacitors plus passive circuitry spaced on the detachable wafer;
• a method whereby a conductive means is fabricated connecting the active transistor and memory regions of the retained wafer to the antenna and passive circuitry regions of the detachable wafer such that all regions of the circuit can function as one integrated circuit when so connected;
• a method of severing the connection between the retained and detachable wafers through a fold or perforation in the substrate of the two wafers so that fine conductive material can be severed thereby halting the circuit;
• for the purpose of protecting consumer privacy in an RFID tagging environment.