Semiconductor device and manufacturing method thereof
OwnerSoichi YAMAZAKI, Koji Yamakawainventors
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Abstract
This disclosure concerns a semiconductor device comprising an insulating film provided on a semiconductor substrate; a lower contact formed in the insulating film; a ferroelectric capacitor including a first lower electrode provided on the lower contact and connected to the lower contact, a second lower electrode provided on the first lower electrode and made of SRO (Strontium Ruthenium Oxide), a ferroelectric film including crystals, and an upper electrode provided on the ferroelectric film, grain diameters of the crystals being set to 30 nm to 150 nm by forming the ferroelectric film on the second lower electrode; and a wiring connected to the upper electrode.
Claims8
A semiconductor device comprising:
- an insulating film provided on a semiconductor substrate;
- a lower contact formed in the insulating film;
- a ferroelectric capacitor including a first lower electrode provided on the lower contact and connected to the lower contact, a second lower electrode provided on the first lower electrode and made of SRO (Strontium Ruthenium Oxide), a ferroelectric film including crystals, and an upper electrode provided on the ferroelectric film, grain diameters of the crystals being set to 30 nm to 150 nm by forming the ferroelectric film on the second lower electrode;
- and
- a wiring connected to the upper electrode.
A semiconductor device comprising:
- an insulating film provided on a semiconductor substrate;
- a lower contact formed in the insulating film;
- a ferroelectric capacitor including a first lower electrode provided on the lower contact and connected to the lower contact, a second lower electrode provided on the first lower electrode, a ferroelectric film formed on the second lower electrode, and an upper electrode provided on the ferroelectric film, the second lower electrode being made of SRO and having a thickness equal to or larger than 5 nm;
- and
- a wiring connected to the upper electrode.
A method of manufacturing a semiconductor device, comprising:
- forming an insulating film on a semiconductor substrate;
- forming a lower contact in the insulating film;
- forming a first lower electrode on the lower contact to be connected to the lower contact;
- forming a second lower electrode made of SRO on the first lower electrode;
- forming a ferroelectric film on the second lower electrode to set grain diameters of crystals of the ferroelectric film to 30 nm to 150;
- forming an upper electrode on the ferroelectric film;
- and
- forming a wiring to be connected to the upper electrode.
Dependencies are inferred from the claim text.