US 2008/0258189 A1 · Image Sensor and Method of Manufacturing the Same

Abstract

An image sensor and a method of manufacturing the same are provided. The image sensor includes a semiconductor substrate, a metal line layer, a first conduction type conducting layer, a first pixel isolation layer, an intrinsic layer, and second conduction type conducting layer. The semiconductor substrate includes a circuit region. The metal line layer including a plurality of metal lines and an interlayer insulating layer is formed on the semiconductor substrate. The first conductive layer having patterns separated from each other by the pixel isolation layer is formed on the metal lines. The first pixel isolation layer is formed between the separated patterns of the first conduction type conducting layer. The intrinsic layer is formed on the first conductive layer and the first pixel isolation layer. The second conduction type conducting layer is formed on the intrinsic layer.

Claims19

Dependent claims

An image sensor, comprising:

a semiconductor substrate comprising a circuit region;
a metal line layer formed on the semiconductor substrate and comprising a plurality of metal lines and an interlayer insulating layer;
a first conductive layer, comprising patterns separated from each other, formed on the plurality of metal lines;
a first pixel isolation layer provided between the patterns of the first conductive layer;
an intrinsic layer formed on the metal line layer;
a second conductive layer formed on the intrinsic layer;
and
a second pixel isolation layer provided in the second conductive layer at positions corresponding to the first pixel isolation layer.

5 more elements

A method of manufacturing an image sensor, the method comprising:

forming a metal line layer, comprising a plurality of metal lines and an interlayer insulating layer, on a semiconductor substrate comprising a circuit region;
forming a first conductive layer having patterns on the plurality of metal lines separated by first pixel isolation layers between the patterns;
forming an intrinsic layer on the first conductive layer patterns and the first pixel isolation layers;
and
forming a second conductive layer on the intrinsic layer.

2 more elements

Dependencies are inferred from the claim text.

Image Sensor and Method of Manufacturing the Same

Life of this patent

Image Sensor and Method of Manufacturing the Same

Life of this patent

Abstract

Claims19