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US 2008/0258167 A1Published application
Package structure for light-emitting elements
OwnerMing-Dah Liu, Chia-Hung Hsuinventors
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Abstract
The present invention discloses a package structure for light-emitting elements, wherein a horizontally-extending thermal conductive plate contacts a thermal conductive substrate having a larger heat-dissipating area. Via such a horizontal heat-dissipation mechanism, the heat generated by light-emitting elements is dissipated at a higher rate; thereby, the light-emitting elements have a higher working efficiency and a longer service life.
Claims8
A package structure for light-emitting elements, comprising:
- a circuit substrate;
- at least one thermal conductive plate with one side disposed on said circuit substrate and the other side extending horizontally;
- and
- at least one light-emitting module disposed on a surface of said circuit substrate but.
1 more element
A package structure for light-emitting elements, comprising:
- a thermal conductive substrate;
- at least one circuit substrate on said thermal conductive substrate;
- at least one thermal conductive plate on said thermal conductive substrate and joined to said circuit substrate side-by-side;
- and
- at least one light-emitting module on said circuit substrate.
2 more elements
Dependencies are inferred from the claim text.