Printed circuit board manufacturing method and printed circuit board
AssigneeInternational Business Machines Corporation
InventorsKohichi Ohsumi, Kenji Terada, Kohichi Yamazaki
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Abstract
The present invention provides a method of manufacturing printed a circuit board capable of formation of via holes having a low aspect ratio and formation of fine lines, and a printed circuit board manufactured by the method. The method of manufacturing a printed circuit board 10 according to the present invention includes a step of selectively forming a plating layer 16 for lands 22a and 22b on a metal foil 14 on the printed circuit board 10, a step of adjusting the thickness of the plating layer 16, and a step of forming the metal foil 14 into lines 14a. The aspect ratio of via holes 28 formed on lands 22a and 22b can be adjusted by adjusting the thickness of the lands 22a and 22b.
Claims10
A printed circuit board comprising:
- an insulating substrate having a front surface and a back surface;
- a line of metal foil selectively formed on at least one of said front surface and said back surface;
- a land selectively formed on at least one of said front surface and said back surface, said land being formed of a stack of said metal foil and a plating layer;
- a dielectric layer formed on an exposed portion and said line;
- and
- a via hole formed on said land.
Dependencies are inferred from the claim text.