Wiring board manufacturing method, semiconductor device manufacturing method and wiring board

A method of manufacturing a wiring board comprising:

• a first step of forming an insulating layer on a support substrate;
• a second step of forming, on the insulating layer, a tapered opening having a small diameter at the support substrate side and a large diameter at an opening side;
• a third step of forming, on an inner part of the tapered opening, an electrode pad having a large diameter at the opening side;
• a fourth step of forming, on a surface of the insulating layer, a wiring layer to be electrically connected to the electrode pad;
• and
• a fifth step of removing the support substrate and exposing an end face at a small diameter side of the electrode pad.

A wiring board comprising:

• an electrode pad;
• and
• an insulating layer formed in contact with the electrode pad, wherein
• the electrode pad is formed to take a taper shape having a large diameter at an insulating layer side on which the insulating layer is formed and a small diameter at an exposed surface side of the electrode pad.