Packaging substrate and method for manufacturing the same

Abstract

The present invention relates to a packaging substrate and a method for manufacturing the same. The packaging substrate includes: a substrate body, having a plurality of conductive pads on the surface thereof, wherein the top surfaces of the conductive pads have a concave each; a solder mask, disposed on the surface of the substrate body and having a plurality of openings to correspondingly expose the concaves of the conductive pads each; and a plurality of metal bumps, disposed correspondingly in the openings of the solder mask and over the concaves of the conductive pads. The present invention increases the joint surface area between the metal bumps and the conductive pads so as to inhibit the joint crack and improve the reliability of the conductive structure of the packaging substrate.

Dependencies are inferred from the claim text.