High thermal conducting circuit substrate and manufacturing process thereof

A high thermal conducting circuit substrate, comprising:

• a metal core substrate, divided into a patterned upper layer, a patterned lower layer and a middle layer stacked alternately, wherein the middle layer is between the upper layer and the lower layer, the upper layer comprises at least a first metal post, an end of the first metal post farther from the middle layer is used as a first bonding pad, the lower layer comprises at least a second metal post, and an end of the second metal post farther from the middle layer is used as a second bonding pad;
• a first insulating layer disposed on a surface of the middle layer and complementary to the upper layer;
• and
• a second insulating layer disposed on another surface of the middle layer and complementary to the lower layer.

A high thermal conducting circuit substrate, comprising:

• a metal core substrate divided into a patterned upper layer, a patterned lower layer and a middle layer stacked alternately, wherein the middle layer is between the upper layer and the lower layer, the middle layer comprises a plurality of traces, the upper layer comprises a plurality of first metal posts which connect respectively to a surface of the traces, the lower layer comprises a plurality of second metal posts which connect respectively to another surface of these traces;
• a first insulating layer disposed on a surface of the middle layer and complementary to the upper layer, the first insulating layer further exposing an end of each first metal post farther from the middle layer, and the ends of the first metal posts serve as a plurality of first bonding pads;
• and
• a second insulating layer disposed on another surface of the middle layer and complementary to the lower layer, the second insulating layer further exposing an end of the second metal posts that is farther from the middle layer, and the end serves as a plurality of second bonding pads.