Method for the production of expandable circuit carrier and expandable circuit carrier
AssigneeFraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
InventorsAndreas Ostmann, Manuel Seckel, Thomas Loher, Dionysios Manessis, Rainer Patzelt
Life of this patent
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Abstract
The present invention relates to a method for the production of an expandable circuit carrier in which a starting material for an expandable substrate is applied on an electrically conductive foil which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such that it forms a conductor structure having at least one expandable strip conductor. The present invention further relates to an expandable circuit carrier which can be produced by the method.
Claims19
A method for the production of an expandable circuit carrier, in which a starting material for an expandable substrate is applied on an electrically conductive foil, which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such that it forms a conductor structure having at least one expandable strip conductor.
An expandable circuit carrier comprising an expandable substrate, a conductor structure which is at least one of embedded in the substrate and disposed on a surface of the substrate, the conductor structure having expandable strip conductors and comprising at least two terminal faces which are connected respectively to one of the strip conductors and also comprising at least one electronic component which has terminals which are connected to the terminal faces in an electrically conductive manner, the expandable circuit carrier being characterized by at least one of the following;
- the conductor structure having reinforcing structures which reinforce the circuit carrier in the vicinity of the terminal faces which are connected to the at least one electronic component without connecting the terminal faces to each other in an electrically conductive manner;
- the at least one electronic component being surrounded by a material which connects the at least one electronic component mechanically to the conductor structure and is more rigid than a material which forms the expandable substrate;
- and, at least one of the terminals of the at least one electronic component being connected by means of a conductive expandable material to the corresponding terminal face.
An expandable circuit carrier comprising an expandable substrate, a conductor structure which is at least one of embedded in the substrate and disposed on a surface of the substrate, the conductor structure having expandable strip conductors and comprising at least two terminal faces which are connected respectively to one of the strip conductors and also comprising at least one electronic component which has terminals which are connected to the terminal faces in an electrically conductive manner, the expandable circuit carrier being characterized by at least one of the following;
- the conductor structure having reinforcing structures which reinforce the circuit carrier in the vicinity of the terminal faces which are connected to the at least one electronic component without connecting the terminal faces to each other in an electrically conductive manner;
- the at least one electronic component being surrounded by a material which connects the at least one electronic component mechanically to the conductor structure and is more rigid than a material which forms the expandable substrate;
- and, at least one of the terminals of the at least one electronic component being connected by means of a conductive expandable material to the corresponding terminal face produced by a method in which a starting material for an expandable substrate is applied on an electrically conductive foil, which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such that it forms a conductor structure having at least one expandable strip conductor.
Dependencies are inferred from the claim text.