Flexible circuit structure with stretchability and method of manufacturing the same
AssigneeIndustrial Technology Research Institute
InventorsYu-Hua CHEN, Ying-Ching SHIH
Life of this patent
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Abstract
A manufacturing method of a flexible circuit structure with stretchability includes the following steps. A plurality of compressible flexible bumps is formed on a flexible substrate; next, a metal circuit is formed on the flexible substrate and each of the compressible flexible bumps. When an external tensile force is applied on the flexible substrate, the capability of the metal circuit in withstanding the external tensile force is improved due to flexibility of the compressible flexible bumps, and thus, the stretchability of the flexible circuit is improved.
Claims43
A flexible circuit structure with stretchability, comprising:
- a flexible substrate;
- a plurality of flexible bumps, formed on the flexible substrate;
- and
- a metal layer, formed on the flexible bumps and the flexible substrate.
A flexible circuit structure with stretchability, comprising:
- a flexible substrate;
- a metal layer, formed on the flexible substrate;
- and
- a plurality of flexible bumps, formed on the metal layer and the flexible substrate.
A flexible circuit structure with stretchability, comprising:
- a flexible substrate;
- an active element, disposed on the flexible substrate;
- a first flexible material layer, formed on the active element and the flexible substrate;
- a plurality of flexible bumps, formed on the flexible substrate;
- and
- a metal layer, formed on the flexible bumps and the flexible substrate.
A method of manufacturing a flexible circuit with stretchability, comprising:
- providing a supporting substrate;
- providing a flexible substrate on the supporting substrate;
- forming a plurality of flexible bumps on the flexible substrate;
- forming a metal layer on the flexible substrate and the flexible bumps;
- and
- forming a flexible material layer on the metal layer.
A method of manufacturing a flexible circuit with stretchability, comprising:
- providing a supporting substrate;
- providing a flexible substrate on the supporting substrate;
- disposing an active element on the flexible substrate;
- forming a first flexible material layer on the active element and the flexible substrate;
- forming at least one via hole in the first flexible material layer;
- forming a plurality of flexible bumps on the first flexible material layer;
- and
- forming a metal layer on the first flexible material layer and the flexible bumps;
- and
- forming a second flexible material layer on the metal layer.
Dependencies are inferred from the claim text.