Multilayer wiring board
AssigneeDenso Corporation
InventorsAkira Wada, Toshihisa Nakano
Life of this patent
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Abstract
A multilayer wiring board includes a substrate and even numbered wiring patterns. The substrate is made of an insulating material. Each of the even numbered wiring patterns is made of a conductive material, and the wiring patterns are laminated onto one another in a lamination direction via the substrate. One of the wiring patterns has a generally equivalent volume to that of a corresponding one of the wiring patterns. Here, the one of the wiring patterns is located on one plane symmetrical to a corresponding plane, on which the corresponding one of the wiring patterns is located, relative to a central position of the wiring patterns in the lamination direction.
Claims8
A multilayer wiring board comprising:
- a substrate that is made of an insulating material;
- and
- even numbered wiring patterns, each of which is made of a conductive material, the wiring patterns being laminated onto one another in a lamination direction via the substrate, wherein:
- one of the wiring patterns has a generally equivalent volume to that of a corresponding one of the wiring patterns, the one of the wiring patterns being located on one plane symmetrical to a corresponding plane, on which the corresponding one of the wiring patterns is located, relative to a central position of the wiring patterns in the lamination direction.
Dependencies are inferred from the claim text.