Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid

A printed circuit board (PCB) assembly having at least one ball grid array (BGA) contact grid, a plurality of circuit layers including an outer layer, a first internal layer and subsequent internal layers with through-vias and micro-vias and interconnects used to translate a portion of the signal connections of the BGA contact grid, thereby creating one or more diagonal routing channel between said vias on internal layers of said board, at least one ball grid array (BGA) package mounted on said PCB, said BGA package being characterized in that said BGA package has power and ground connections which are laid out such that said power and ground connections do not fall on alternating contact locations in any given row or column on said PCB and said power and ground connections only fall on through-vias and do not fall on micro-vias.