# US 2008/0218970 A1 · Thermal Management for a Ruggedized Electronics Enclosure

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2008/0218970 A1
- Document ID: US20080218970A1
- Status: Published application
- Kind: A1
- Application number: 12/020,487
- Filed: 2008-01-25
- Published: 2008-09-11
- Earliest claimed: 2002-08-30
- Assignees: Themis Computer
- Inventors: William E. Kehret; Dennis H. Smith
- Web page: https://patentgrep.com/patent/US20080218970A1

## CPC

- H05K 7/20418: {the radiating structures being additional and fastened onto the housing}
- H05K 7/1434: {for electronics exposed to high gravitational force; Cylindrical housings}
- H05K 7/20254: {Cold plates transferring heat from heat source to coolant}
- H05K 7/20445: {the coupling element being an additional piece, e.g. thermal standoff}
- H05K 7/20509: {Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

The present invention relates to a liquid cooling assembly for cooling electronic components. The liquid cooling assembly contains a heat spreader plate for providing mechanical support and thermal dissipation; a fluid channel for directing a cooling fluid in the plane of the heat spreader; and a bottom plate for protecting against destructive shock events and for providing thermal dissipation. The present invention also provides a maze structure in the liquid cooling assembly to increase structural stability against destructive shock events. The present invention also relates to a ruggedized electronics enclosure for housing electronic components. A top compartment contains a first electronics layer and a second electronics layer adjacent to said first electronics layer and a cooling assembly. A thermal shunt is configured to channel heat from the first and second electronics layers to the cooling assembly and to provide additional mechanical support to protect against potentially destructive shock events.

## Claims

### Claim 1

A liquid cooling assembly for cooling electronic components, the cooling assembly comprising:
a heat spreader unit;
a structural foam layer, rigidly coupled to said heat spreader unit, providing mechanical support and thermal dissipation for the electronic components;
a fluid channel, rigidly coupled to said structural foam layer, for directing a cooling fluid in a first direction; and
a bottom plate rigidly coupled to said structural foam layer, wherein said heat spreader unit, said structural foam layer, and said bottom plate providing a rigid structure that does not substantially deform in response to one or more destructive shock events, to protect the electronic components against said one or more destructive shock events and to provide thermal dissipation of heat generated by the electronic components.

### Claim 2 (depends on 1)

The liquid cooling assembly of claim 1, wherein said structural foam layer further comprises a fluid channel groove.

### Claim 3 (depends on 1)

The liquid cooling assembly of claim 1, wherein said fluid channel is adhered to said fluid channel groove by way of a thermally conductive epoxy.

### Claim 4 (depends on 1)

The liquid cooling assembly of claim 1, wherein said structural foam layer is formed with a closed-cell foam.

### Claim 5 (depends on 1)

The liquid cooling assembly of claim 1, wherein said structural foam layer is formed with a substantially non-compressible material that has a substantially high thermal conductivity

### Claim 6 (depends on 1)

The liquid cooling assembly of claim 1, wherein said bottom plate is embedded with a reinforcing fiber to provide structural strength and stiffness for compressive and extension forces, to improve the normal mode mechanical performance of the truss structure.

### Claim 7

A liquid cooling assembly for cooling electronic components, the cooling assembly comprising:
a heat spreader unit;
a maze structure, rigidly coupled to said heat spreader unit, providing mechanical support and thermal dissipation for the electronic components;
a fluid channel, rigidly coupled to said maze structure, for directing a cooling fluid in a first direction; and
a bottom plate rigidly coupled to said maze structure, wherein said heat spreader unit, said maze structure, and said bottom plate providing a rigid structure that does not substantially deform in response to one or more destructive shock event, to protect the electronic components against said one or more destructive shock events and to provide thermal dissipation of heat generated by the electronic components.

### Claim 8 (depends on 7)

The liquid cooling assembly of claim 7, wherein said maze structure further comprises a matrix of cells.

### Claim 9 (depends on 8)

The liquid cooling assembly of claim 8, wherein said matrix of cells are fabricated from a high tensile strength, highly thermally conductive material.

### Claim 10 (depends on 8)

The liquid cooling assembly of claim 8, wherein said matrix of cells is fabricated from aluminum, graphite, or any particular reinforced carbon fiber.