# US 2008/0189245 A1 · Accessing data from diverse semiconductor manufacturing applications

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- Number: US 2008/0189245 A1
- Document ID: US20080189245A1
- Status: Published application
- Kind: A1
- Application number: 11/529,802
- Filed: 2006-09-29
- Published: 2008-08-07
- Earliest claimed: 2006-09-29
- Inventors: Joel Fenner; Sutirtha Bhattacharya; Anju Narendra
- Web page: https://patentgrep.com/patent/US20080189245A1

## CPC

- G06F 16/2456: {Join operations}
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)

## Abstract

Data extraction for semiconductor process analysis may be implemented across multiple databases. A user may select a given level of interest, such as a wafer, a lot, or a die, and may extract specified information across more than one database if desired. The databases may include separate information such as process control information, electrical, and sort test information. Instead of coalescing the databases into one extremely unmanageable database, data can be extracted horizontally across those databases using structured queries.

## Claims

### Claim 1

a method comprising:
extracting information for engineering analysis of a semiconductor processing operation across a plurality of databases.

### Claim 2 (depends on 1)

The method of claim 1 including extracting information from a database including process control information and another database including work in process history information.

### Claim 3 (depends on 1)

The method of claim 1 including extracting information from at least two databases including at least two of the following: work in process history information, process control information, sort data, or electrical test data.

### Claim 4 (depends on 1)

The method of claim 1 including developing a unique wafer identifier to be used by at least two different databases.

### Claim 5 (depends on 1)

The method of claim 1 including developing a unique run level identifier that identifies a run including re-working or re-measuring.

### Claim 6 (depends on 1)

The method of claim 1 including providing a process batch identifier that changes when a new process operation is done and not when a metrology operation is done.

### Claim 7 (depends on 1)

The method of claim 1 including enabling the selection of a level for data extraction including at least one of a lot level, a wafer level, or a die level.

### Claim 8 (depends on 1)

The method of claim 1 including enabling the selection of a particular database for data extraction.

### Claim 9 (depends on 1)

The method of claim 1 including providing a list of material selections to select for data extraction across at least two domains.

### Claim 10 (depends on 1)

The method of claim 1 including allowing the selection of one of at least two data join strategies.

### Claim 11

A computer readable medium storing instructions to cause a processor-based system to:
extract information for engineering analysis of a semiconductor processing operation across a plurality of databases.

### Claim 12 (depends on 11)

The medium of claim 11 further storing instructions to extract information from a database including process control information and from another database including work in process history information.

### Claim 13 (depends on 11)

The medium of claim 11 further storing instructions to extract information from at least two databases including at least two of the following: work in process history information, process control information, sort data, or electrical test data.

### Claim 14 (depends on 11)

The medium of claim 11 further storing instructions to develop a unique way for an identifier to be used by at least two different databases.

### Claim 15 (depends on 11)

The medium of claim 11 further storing instructions to develop a unique run level identifier to identify a run including re-working or re-measuring.

### Claim 16 (depends on 11)

The medium of claim 11 further storing instructions to provide a process batch identifier that changes when a new process operation is done and not when a metrology operation is done.

### Claim 17 (depends on 11)

The medium of claim 11 further storing instructions to enable the selection of a level for data extraction including at least one of a lot level, a wafer lever, or a die level.

### Claim 18 (depends on 11)

The medium of claim 11 further storing instructions to enable the selection of a particular database for data extraction.

### Claim 19 (depends on 11)

The medium of claim 11 further storing instructions to provide a list of material selections to select for data extraction across at least two domains.

### Claim 20 (depends on 11)

The medium of claim 11 further storing instructions to allow the selection of one of at least two data join strategies.

### Claim 21

A system comprising:
a data extraction tool to extract information for engineering analysis of a semiconductor processing operation across a plurality of databases; and
a database adaptor to translate information from different databases to a generic schema.

### Claim 22 (depends on 21)

The system of claim 21 coupled to a plurality of databases.

### Claim 23 (depends on 22)

The system of claim 22 including databases for at least two of work in process history information, process control information, sort data, and electrical test data.

### Claim 24 (depends on 21)

The system of claim 21 wherein data can be obtained from more than one database in the form of a run level identifier that identifies a run as including re-working or re-measuring.

### Claim 25 (depends on 21)

The system of claim 21 wherein said data extraction tool includes a unique wafer identifier that is used in at least two different databases.
