# US 2008/0187776 A1 · Multilayer substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2008/0187776 A1 - Document ID: US20080187776A1 - Status: Published application - Kind: A1 - Application number: 12/026,863 - Filed: 2008-02-06 - Published: 2008-08-07 - Earliest claimed: 2007-02-06 - Assignees: Rohm Co., Ltd. - Inventors: Ken Nakahara; Hiroyuki Yuji; Kentaro Tamura; Shunsuke Akasaka; Yoshio Nishimoto; Masashi Kawasaki; Akira Ohtomo; Atsushi Tsukazaki - Web page: https://patentgrep.com/patent/US20080187776A1 ## CPC - C23C 28/322: {only coatings of metal elements only} - C23C 28/34: {including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates} - C23C 28/345: {with at least one oxide layer} - C23C 28/3455: {with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer} - Y10T 428/12778: Alternative base metals from diverse categories - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Provided is a multilayer substrate having the configuration in which a multilayer film is formed on a principal surface opposite to a principal surface in the oxide-thin-film lamination direction in a translucent substrate. The multilayer film is formed by sequentially laminating a dielectric film, Au (gold) film, and oxide film in this order from the translucent substrate. On the principal surface opposite to the principal surface on which the oxide thin film is disposed, the multilayer film containing the Au film is formed, the Au film can reflect and block the excessive infrared light from a substrate holder or a heat source at the time of growth. As a result, temperature can be accurately measured. ## Claims ### Claim 1 A multilayer substrate comprising: a translucent substrate being transparent in an infrared region; and a multilayer film containing one of an Au film and a Pt film, and being formed on a first principal surface of the translucent substrate, the first principal surface being opposite to a principal surface on which a thin film containing oxygen as a constituent element is grown and thermally treated in the translucent substrate. ### Claim 2 (depends on 1) The multilayer substrate of claim 1, wherein the translucent substrate includes an oxide substrate for growing the thin film containing oxygen as the constituent element. ### Claim 3 (depends on 1) The multilayer substrate of claim 1, wherein the multilayer film includes one of a dielectric film having one layer and a dielectric film having a plurality of layers, between the translucent substrate and one of the Au and the Pt film. ### Claim 4 (depends on 2) The multilayer substrate of claim 2, wherein the multilayer film includes one of a dielectric film having one layer and a dielectric film having a plurality of layers, between the translucent substrate and one of the Au and the Pt film. ### Claim 5 (depends on 3) The multilayer substrate of claim 3, wherein at least one layer of the dielectric film is formed of an oxide. ### Claim 6 (depends on 4) The multilayer substrate of claim 4, wherein at least one layer of the dielectric film is formed of an oxide. ### Claim 7 (depends on 3) The multilayer substrate of claim 3, wherein the dielectric film is formed to come in contact with one of the Au film and the Pt film. ### Claim 8 (depends on 4) The multilayer substrate of claim 4, wherein the dielectric film is formed to come in contact with one of the Au film and the Pt film. ### Claim 9 (depends on 5) The multilayer substrate of claim 5, wherein the dielectric film is formed to come in contact with one of the Au film and the Pt film. ### Claim 10 (depends on 6) The multilayer substrate of claim 6, wherein the dielectric film is formed to come in contact with one of the Au film and the Pt film. ### Claim 11 (depends on 3) The multilayer substrate of claim 3, wherein the dielectric film is formed one of NiO and TiO2. ### Claim 12 (depends on 4) The multilayer substrate of claim 4, wherein the dielectric film is formed of one of NiO and TiO2. ### Claim 13 (depends on 5) The multilayer substrate of claim 5, wherein the dielectric film is formed of one of NiO and TiO2. ### Claim 14 (depends on 6) The multilayer substrate of claim 6, wherein the dielectric film is formed of one of NiO and TiO2. ### Claim 15 (depends on 7) The multilayer substrate of claim 7, wherein the dielectric film is formed of one of NiO and TiO2. ### Claim 16 (depends on 8) The multilayer substrate of claim 8, wherein the dielectric film is formed of one of NiO and TiO2. ### Claim 17 (depends on 9) The multilayer substrate of claim 9, wherein the dielectric film is formed of one of NiO and TiO2. ### Claim 18 (depends on 10) The multilayer substrate of claim 10, wherein the dielectric film is formed of one of NiO and TiO2.