# US 2008/0187672 A1 · Method and Composition for Improving Adhesion of Organic Polymer Coatings with Copper Surface > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2008/0187672 A1 - Document ID: US20080187672A1 - Status: Published application - Kind: A1 - Application number: 11/914,472 - Filed: 2006-05-15 - Published: 2008-08-07 - Earliest claimed: 2005-05-16 - Assignees: 3M Innovative Properties Company - Inventors: Zhigang Yu - Web page: https://patentgrep.com/patent/US20080187672A1 ## CPC - H05K 3/383: {by microetching} - C23C 22/63: Treatment of copper or alloys based thereon - C23F 1/34: for etching copper or alloys thereof - H05K 2203/0793: Aqueous alkaline solution, e.g. for cleaning or etching - H05K 2203/0796: Oxidant in aqueous solution, e.g. permanganate - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - C23F: NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE (working metal by laser beams B23K26/00; desurfacing by applying flames B23K7/00; working of metal by electro-erosion B23H; producing decorative effects by removing surface material, e.g. by engraving, by etching, B44C1/22; electrolytic etching or polishing C25F); INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ## Abstract The present invention provides an aqueous solution composition for treating copper surface to improve adhesion of organic polymer with copper surface, characterized in that, said aqueous solution composition comprises water-soluble persulfate and the pH of said composition is from 11-14. The present invention further provides a method for improving the adhesion of organic polymer with copper surface by treating said copper surface and a method for preparing an article having a copper surface which is coated with organic polymer coating. The present composition and method are applicable to the adhesion of any polymer coatings, especially, epoxy, phenolic aldehyde, melamine and polyurea resin on copper surface. ## Claims ### Claim 1 An aqueous solution composition for treating copper surface to improve adhesion of organic polymer with copper surface, characterized in that, said aqueous solution composition comprises water-soluble persulfate and the pH of said composition is from 11-14. ### Claim 2 (depends on 1) The composition of claim 1, wherein said composition is essentially consisted of water-soluble sulfate, water-soluble persulfate, water-soluble polymer, cosolvent, surfactant and water. ### Claim 3 (depends on 2) The composition of claim 2, wherein said water-soluble sulfate is selected from sodium sulfate, potassium sulfate and ammonium sulfate, and said water-soluble persulfate is selected from potassium persulfate, sodium persulfate and ammonium persulfate. ### Claim 4 (depends on 2) The composition of claim 2, wherein said water-soluble polymer is selected from polyvinyl alcohol, polyvinylpyrrolidone, polyamide, polyacrylate, polyurethane; said cosolvent is selected from isopropanol, ethylene glycol, propylene glycol, glycerin, butyl cellusolve, diethylene glycol methyl ether, dipropylene glycol methyl ether, diethylene glycol methyl ether acetate, N-methyl pyrrolidone, dimethyl ethanolamine; and, said surfactant is selected from fluorine-containing surfactant, silicon-containing surfactant, aliphatic alcohol polyoxyethylene ether, polyoxyethylene phenol ether, polyoxyethylene alkyl amine, sodium dodecanesulphonate, sodium dodecyl sulfate, fatty glyceride, and alanine. ### Claim 5 (depends on 2) The composition of claim 2, wherein said composition comprising 0.3-2 wt % of water-soluble sulfate, 0.3-10 wt % of water-soluble persulfate, 0.1-1 wt % of water-soluble polymer, 0.5-5 wt % of cosolvent, and 0.05-0.3 wt % of surfactant. ### Claim 6 (depends on 1) A method for improving the adhesion of organic polymer with copper surface by treating said copper surface, said method including the step of dipping said copper surface in the aqueous solution composition of claim 1 or coating the aqueous solution composition of claim 1 onto said copper surface, under the temperature of 35-100° C., until the copper surface becomes black, wherein said aqueous solution composition comprises water-soluble persulfate and the pH of said composition is from 11-14. ### Claim 7 (depends on 1) A method for preparing an article having a copper surface which is coated with organic polymer coating, said method comprises the following steps: a) providing an article having a copper surface on which the organic polymer coating is to be coated on; b) dipping said copper surface in the aqueous solution composition of claim 1 or coating the aqueous solution composition of claim 1 onto said copper surface, under the temperature of 35-100° C., until the copper surface becomes black, wherein said aqueous solution composition comprises water-soluble persulfate and the pH of said composition is from 11-14; c) coating organic polymer onto said copper surface treated by the step b), thereby obtaining said article having a copper surface which is coated with organic polymer coating. ### Claim 8 (depends on 7) The method of claim 7, wherein said organic polymer is selected from polyacrylate, amine resin, phenol aldehyde resin, alkide resin, polyamide, epoxy, polyurethane, melamine, polyurea resin, organosilicon and fluororesin. ### Claim 9 (depends on 7) An article having a copper surface which is coated with organic polymer coating prepared according to the method of claim 7. ### Claim 10 (depends on 1) The use of the aqueous solution composition of claim 1 in the treatment of copper surface to improve adhesion of organic polymer with copper surface.