# US 2008/0187299 A1 · Heat treatment apparatus, computer program, and storage medium > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2008/0187299 A1 - Document ID: US20080187299A1 - Status: Published application - Kind: A1 - Application number: 12/053,336 - Filed: 2008-03-21 - Published: 2008-08-07 - Earliest claimed: 2005-09-21 - Assignees: Tokyo Electron Limited - Inventors: Masahiro Shimizu; Shigeru Kasai; Masatake Yoneda - Web page: https://patentgrep.com/patent/US20080187299A1 ## CPC - H10P 72/0436: {mainly by radiation} - H10P 72/0434: {mainly by convection} - H10P 95/90: Thermal treatments, e.g. annealing or sintering - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A heat treatment apparatus for performing prescribed heat treatment to a subject (W) to be treated is provided with a processing chamber in which air can be exhausted; a mounting table arranged in the processing chamber, for placing on an upper plane the subject to be treated; a plurality of thermoelectric conversion elements arranged on an upper part of the mounting table; a light transmitting window for covering a ceiling portion of the processing chamber airtight; and a gas introduction unit for introducing a required gas into the processing chamber. A heating unit which includes a plurality of heating light sources including a semiconductor light emitting element for emitting heating light to the subject to be treated, is provided above the light transmitting window. Thus, heating efficiency is improved and temperature can be increased and reduced at a higher speed for the subject to be treated. ## Claims ### Claim 1 A heat treatment apparatus for performing a specified heat treatment on a target object, comprising: an evacuable processing chamber; a mounting table on which the target object is mounted, the mounting table being disposed in the processing chamber; a plurality of thermoelectric conversion elements disposed in an upper portion of the mounting table; a light transmitting window for airtightly covering a ceiling portion of the processing chamber; a gas introduction unit for introducing a required gas into the processing chamber; and a heating unit for emitting light for heating to the target object through the light transmitting window, the heating unit being disposed above the light transmitting window and having a plurality of heating sources each of which includes a semiconductor light emitting element. ### Claim 2 (depends on 1) The heat treatment apparatus of claim 1, wherein first reflectors are being disposed in the vicinity of the respective heating sources, the first reflectors serving to reflect light from the respective heating sources to the target object. ### Claim 3 (depends on 2) The heat treatment apparatus of claim 2, wherein the light reflected by each of the first reflector is focused on corresponding area of the target object. ### Claim 4 (depends on 2) The heat treatment apparatus of claim 2, wherein a reflective surface of the first reflector is of a curved shape. ### Claim 5 (depends on 1) The heat treatment apparatus of claim 1, wherein each of the heating sources includes an element attachment rod having a heat pipe, and each of the semiconductor light emitting elements is attached to an end portion of the corresponding element attachment rod. ### Claim 6 (depends on 5) The heat treatment apparatus of claim 5, wherein the heating unit includes an element attachment housing to cover a top portion of the light transmitting window, and a base portion of each of the element attachment rod is supported by the element attachment housing. ### Claim 7 (depends on 6) The heat treatment apparatus of claim 6, wherein the element attachment housing is of a dome shape, and its inner surface has a curved reflective surface serving as a second reflector. ### Claim 8 (depends on 6) The heat treatment apparatus of claim 6, wherein the element attachment housing is provided with an element cooling unit for cooling the base portion of the element attachment rods. ### Claim 9 (depends on 5) The heat treatment apparatus of claim 5, wherein each of the element attachment rods is extended in a vertical or near vertical direction. ### Claim 10 (depends on 1) The heat treatment apparatus of claim 1, further comprising a radiation thermometer for measuring a temperature of the target object, wherein a measurement wavelength band of the radiation thermometer is set different from that of the light emitted from the semiconductor light emitting elements. ### Claim 11 (depends on 1) The heat treatment apparatus of claim 1, wherein the semiconductor light emitting elements are formed of an LED or semiconductor laser device. ### Claim 12 (depends on 1) The heat treatment apparatus of claim 1, wherein the heating unit includes an element attachment housing to cover a top portion of the light transmitting window, and a lower surface of the element attachment housing is a flat element attachment surface facing the mounting table, the semiconductor light emitting elements of the heating sources are provided at the element attachment surface. ### Claim 13 (depends on 12) The heat treatment apparatus of claim 12, wherein an area of the element attachment surface where the semiconductor light emitting elements are disposed is formed larger than a projected area of the target object mounted on the mounting table. ### Claim 14 (depends on 12) The heat treatment apparatus of claim 12, wherein a specified number of the semiconductor light emitting elements are attached to a single small element installation substrate, and the single element installation substrate and the semiconductor light emitting elements attached thereto form a block module. ### Claim 15 (depends on 14) The heat treatment apparatus of claim 14, wherein each element installation substrates is made of high thermoconductive material and has a cross section of a recess shape. ### Claim 16 (depends on 14) The heat treatment apparatus of claim 14, wherein the semiconductor light emitting elements attached to the element installation substrate of each module are electrically connected in series. ### Claim 17 (depends on 15) The heat treatment apparatus of claim 15, wherein either one or both of the element attachment surface of the element attachment housing and a surface of the element installation substrate are reflective surfaces functioning as reflectors, respectively. ### Claim 18 (depends on 12) The heat treatment apparatus of claim 12, wherein each of the semiconductor light emitting elements includes an LED or semiconductor laser device. ### Claim 19 (depends on 12) The heat treatment apparatus of claim 12, wherein each of the semiconductor light emitting elements includes an LED or semiconductor laser chip. ### Claim 20 (depends on 12) The heat treatment apparatus of claim 12, wherein each of the semiconductor light emitting elements is a surface-emitting type device. ### Claim 21 (depends on 12) The heat treatment apparatus of claim 12, wherein the semiconductor light emitting elements are partitioned into a plurality of zones, each of which is independently controlled. ### Claim 22 (depends on 1) The heat treatment apparatus of claim 1, wherein a heat transfer medium path is formed in the vicinity of the thermoelectric conversion elements for flowing a heat transfer medium therethrough when necessary. ### Claim 23 (depends on 1) The heat treatment apparatus of claim 1, further comprising a control unit for controlling an operation of the entire heat treatment apparatus, wherein, in case of heating the target object, the control unit turns the heating unit on and allows an electric current to flow to the thermoelectric conversion elements through a thermoelectric conversion element control unit to heat the target object, and, in case of cooling the target object, the control unit turns the heating unit off and allows an electric current to flow to the thermoelectric conversion elements through the thermoelectric conversion element control unit to cool the target object. ### Claim 24 A heat treatment apparatus for performing a specified heat treatment on a target object, comprising: an evacuable processing chamber; a mounting table on which the target object is mounted, the mounting table being disposed in the processing chamber; a lower heating unit for heating the target object, the lower heating unit being disposed in the mounting table or below the mounting table; a light transmitting window for airtightly covering a ceiling portion of the processing chamber; a gas introduction unit for introducing a required gas into the processing chamber; and a heating unit for emitting light for heating to the target object through the light transmitting window, the heating unit being disposed above the light transmitting window and having a plurality of heating sources each of which includes a semiconductor light emitting element. ### Claim 25 (depends on 24) The heat treatment apparatus of claim 24, wherein the lower heating unit includes a resistance heater or a heating lamp. ### Claim 26 (depends on 24) The heat treatment apparatus of claim 24, further comprising a control unit for controlling an operation of the entire heat treatment apparatus, wherein, in case of heating the target object, the control unit turns the lower heating unit on to heat the target object to a predetermined preliminary heating temperature and then turns the heating unit on to raise the temperature of the target object to a predetermined processing temperature. ### Claim 27 A computer program for controlling a heat treatment apparatus which performs a specified heat treatment on a target object, the heat treatment apparatus comprising an evacuable processing chamber; a mounting table on which the target object is mounted, the mounting table being disposed in the processing chamber; a plurality of thermoelectric conversion elements disposed in an upper portion of the mounting table; a light transmitting window for airtightly covering a ceiling portion of the processing chamber; a gas introduction unit for introducing a required gas into the processing chamber; and a heating unit for emitting light for heating to the target object through the light transmitting window, the heating unit being disposed above the light transmitting window and having a plurality of heating sources each of which includes a semiconductor light emitting element, wherein, in case of heating the target object, the heating unit is turned on and an electric current is made to flow to the thermoelectric conversion elements to heat the target object, and, in case of cooling the target object, the heating unit is turned off and an electric current is made to flow to the thermoelectric conversion elements to cool the target object. ### Claim 28 A computer program for controlling a heat treatment apparatus which performs a specified heat treatment on a target object, the heat treatment apparatus comprising an evacuable processing chamber; a mounting table on which the target object is mounted, the mounting table being disposed in the processing chamber; a lower heating unit for heating the target object, the lower heating unit being disposed in the mounting table or below the mounting table; a light transmitting window for airtightly covering a ceiling portion of the processing chamber; a gas introduction unit for introducing a required gas into the processing chamber; and a heating unit for emitting light for heating to the target object through the light transmitting window, the heating unit being disposed above the light transmitting window and having a plurality of heating sources each of which includes a semiconductor light emitting element, wherein, in case of heating the target object, the lower heating unit is turned on to heat the target object to a predetermined preliminary heating temperature and then the heating unit is turned on to raise the temperature of the target object to a predetermined processing temperature. ### Claim 29 A storage medium storing therein a computer program for controlling a heat treatment apparatus which performs a specified heat treatment on a target object, the heat treatment apparatus comprising an evacuable processing chamber; a mounting table on which the target object is mounted, the mounting table being disposed in the processing chamber; a plurality of thermoelectric conversion elements disposed in an upper portion of the mounting table; a light transmitting window for airtightly covering a ceiling portion of the processing chamber; a gas introduction unit for introducing a required gas into the processing chamber; and a heating unit for emitting light for heating to the target object through the light transmitting window, the heating unit being disposed above the light transmitting window and having a plurality of heating sources each of which includes a semiconductor light emitting element, wherein, in case of heating the target object, the heating unit is turned on and an electric current is made to flow to the thermoelectric conversion elements to heat the target object, and, in case of cooling the target object, the heating unit is turned off and an electric current is made to flow to the thermoelectric conversion elements to cool the target object. ### Claim 30 A storage medium storing therein a computer program for controlling a heat treatment apparatus which performs a specified heat treatment on a target object, the heat treatment apparatus comprising an evacuable processing chamber; a mounting table on which the target object is mounted, the mounting table being disposed in the processing chamber; a lower heating unit disposed in the mounting table or below the mounting table to heat the target object; a light transmitting window for airtightly covering a ceiling portion of the processing chamber; a gas introduction unit for introducing a required gas into the processing chamber; and a heating unit for emitting light for heating to the target object through the light transmitting window, the heating unit being disposed above the light transmitting window and having a plurality of heating sources each of which includes a semiconductor light emitting element, wherein, in case of heating the target object, the lower heating unit is turned on to preliminarily heat the target object until to reach at a predetermined temperature and then the heating unit is turned on to heat the target object until to reach at a predetermined temperature.