# US 2008/0187272 A1 · Optical module with electrically isolated stem and cap > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2008/0187272 A1 - Document ID: US20080187272A1 - Status: Published application - Kind: A1 - Application number: 12/007,990 - Filed: 2008-01-17 - Published: 2008-08-07 - Earliest claimed: 2007-01-18 - Assignees: Sumitomo Electric Industries, Ltd. - Inventors: Shunsuke Sato - Web page: https://patentgrep.com/patent/US20080187272A1 ## CPC - G02B 6/4246: {Bidirectionally operating package structures} - G02B 6/4292: {the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS ## Abstract The present invention provides an optical module with a new stem to reduce the EMI noise and to enhance the ESD tolerance of the optical transceiver. The optical module comprises the stem, a cap and a optical device installed in a space formed by the stem and the cap. The stem includes a center portion that mounts the optical device and a peripheral portion that holds the cap. Between the center portion and the peripheral portion is provided with an insulator to electrical isolate two portions. The case lead directly connected to the center portion and to the circuit board within the transceiver may be fully isolated from the frame ground connected to the sleeve and the peripheral portion. ## Claims ### Claim 1 An optical module, comprising: a semiconductor optical device; a stem including a center portion, a peripheral portion and a insulator interposed between said center portion and said peripheral portion, said center portion mounting said semiconductor optical device; a plurality of lead pins, at least one of lead pins directly and electrically connected to said center portion; and a metal cap held in said peripheral portion of said stem, said metal cap and said stem forming a space where said semiconductor optical device is installed, wherein said at least one lead pin is fully isolated from said meal cap by said insulator. ### Claim 2 (depends on 1) The optical module according to claim 1, wherein said stem has a disk shape and said metal cap has a cylindrical shape to form a CAN package of said optical module together with said stem. ### Claim 3 (depends on 2) The optical module according to claim 2, wherein said center portion has a disk shape, said insulator has a ring shape surrounding said disk-shaped center portion and said peripheral portion has a ring shape. ### Claim 4 (depends on 1) The optical module according to claim 1, wherein said insulator is made of ceramics. ### Claim 5 (depends on 4) The optical module according to claim 4, wherein said insulator is made of one of alumina and aluminum nitride. ### Claim 6 An optical sub-assembly installed in an optical transceiver with a housing providing a frame ground and a circuit board providing a signal ground, comprising: an optical module including a stem, a cap, a semiconductor optical device, and a plurality of lead pins, said stem comprising a center portion, a peripheral portion and an insulator interposed between said center portion and said peripheral portion, said center portion mounting said semiconductor optical device, said peripheral portion holding said cap, at least one of said lead pins being directly and electrically connected to said center portion in one end thereof and to said signal ground on said circuit board; a sleeve member configured to receive an external optical connector with an optical fiber to be optically coupled with said semiconductor optical device, said sleeve member exposing outside of said optical transceiver to receive said optical connector, said sleeve member electrically connected to said frame ground of said housing of said optical transceiver; and a joint member arranged between said sleeve member and said optical module to optically couple said optical module with said sleeve member, wherein said signal ground is electrically isolated from said frame ground. ### Claim 7 (depends on 6) The optical sub-assembly according to claim 6, wherein said center portion has a disk shape, said insulator has a ring shape surrounding said disk-shaped center portion and said peripheral portion has a ring shape. ### Claim 8 (depends on 6) The optical sub-assembly according to claim 6, wherein said joint member is made of metal and welded to outer surface of said cap, and wherein said sleeve member includes a bush and a sleeve, said sleeve receiving said ferrule of said external connector, at least said bush being configured to be made of metal, to be connected to said housing of said optical transceiver and to be welded to said joint member. ### Claim 9 (depends on 8) The optical sub-assembly according to claim 8, wherein said sleeve is split sleeve made of ceramics. ### Claim 10 (depends on 8) The optical sub-assembly according to claim 8, wherein said sleeve is rigid sleeve made of metal. ### Claim 11 (depends on 6) The optical module according to claim 6, wherein said insulator is made of ceramics. ### Claim 12 (depends on 11) The optical module according to claim 11, wherein said insulator is made of one of alumina and aluminum nitride.