# US 2008/0186685 A1 · Printed circuit board and semiconductor memory module using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2008/0186685 A1 - Document ID: US20080186685A1 - Status: Published application - Kind: A1 - Application number: 12/013,245 - Filed: 2008-01-11 - Published: 2008-08-07 - Earliest claimed: 2007-02-06 - Assignees: Samsung Electronics Co., Ltd. - Inventors: Jung-Chan CHO; Hyun-Seok CHOI; Yong-Hyun KIM; Hyung-Mo HWANG; Kyu-Tae KIM - Web page: https://patentgrep.com/patent/US20080186685A1 ## CPC - H05K 1/0207: {using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes} - H05K 1/056: {the metal substrate being covered by an organic insulating layer} - H05K 3/4641: {having integrally laminated metal sheets or special power cores} - H05K 2201/0919: Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes - H05K 2201/10159: Memory - H05K 2201/1056: Metal over component, i.e. metal plate over component mounted on or embedded in PCB - H05K 2203/1572: Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract The invention provides a semiconductor memory module. The semiconductor memory module includes a printed circuit board part having a first surface and a second surface facing the first surface, and a metal core having an insert part inserted inside the printed circuit board part and an extension part elongated from at least one side of the printed circuit board. The semiconductor memory module also includes memory parts mounted on the printed circuit board. The metal core has a folding structure having at least one bent portion to substantially cover the memory parts. ## Claims ### Claim 1 A printed circuit board comprising: a printed circuit board part having a first surface and a second surface facing the first surface; and a metal core including an insert part inserted inside the printed circuit board part and including an extension part elongated from at least one side of the printed circuit board part, wherein the metal core has a folding structure having at least one bent portion. ### Claim 2 (depends on 1) The printed circuit board of claim 1, wherein the metal core includes two metal cores, each of the metal cores including an insert part and an extension part. ### Claim 3 (depends on 2) The printed circuit board of claim 2, wherein the extension parts of the two metal cores are respectively elongated from opposite sides of the printed circuit board part to face each other. ### Claim 4 (depends on 1) The printed circuit board of claim 1, wherein the metal core comprises a thermal conductive material. ### Claim 5 (depends on 4) The printed circuit board of claim 4, wherein the thermal conductive material comprises at least one selected from a group of aluminum, copper, silver, or gold. ### Claim 6 (depends on 1) The printed circuit board of claim 1 wherein the extension part has a saw blade-shaped surface. ### Claim 7 (depends on 1) The printed circuit board of claim 1, wherein the extension part includes at least one hole. ### Claim 8 (depends on 1) The printed circuit board is claim 1, wherein the printed circuit board part further comprises connector connecting pins provided on at least one surface of one selected between the first surface and the second surface. ### Claim 9 A semiconductor memory module comprising: a printed circuit board comprising a printed circuit board part having a first surface and a second surface facing the first surface, and a metal core having an insert part inserted inside the printed circuit board part and an extension part elongated from at least one side of the printed circuit board; and memory parts mounted on the printed circuit board, wherein the metal core has a folding structure having at least one bent portion to substantially cover the memory parts. ### Claim 10 (depends on 9) The semiconductor memory module of claim 9, wherein the memory parts are mounted on the first surface and the second surface of the printed circuit board. ### Claim 11 (depends on 9) The semiconductor memory module of claim 9, wherein the metal core includes two metal cores, each of the metal cores including an insert part and an extension part. ### Claim 12 (depends on 11) The semiconductor memory module of claim 11, wherein the extension parts of the two metal cores are elongated from opposite sides of the printed circuit board part to face each other. ### Claim 13 (depends on 9) The semiconductor memory module of claim 9, further comprising mounting means provided between the printed circuit board and the memory parts. ### Claim 14 (depends on 9) The semiconductor memory module of claim 9, wherein the metal core comprises a thermal conductive material. ### Claim 15 (depends on 14) The semiconductor memory module of claim 14, wherein the thermal conductive material comprises one selected from a group of aluminum, copper, silver, or gold. ### Claim 16 (depends on 9) The semiconductor memory module of claim 9, wherein the extension part has a saw blade-shaped surface. ### Claim 17 (depends on 9) The semiconductor memory module of claim 9, wherein the extension part includes at least one hole. ### Claim 18 (depends on 9) The semiconductor memory module of claim 9, further comprising fixing means provided between the memory parts and the extension part. ### Claim 19 (depends on 18) The semiconductor memory module of claim 18, wherein the fixing means includes an adhesive material or a heat sink material having adhesiveness. ### Claim 20 (depends on 9) The semiconductor memory module of claim 9, further comprising internal supporting means provided between the printed circuit board and the extension part. ### Claim 21 (depends on 9) The semiconductor memory module of claim 9, further comprising external supporting means surrounding at least a portion of the printed circuit board, the external supporting means covering at least a portion of the printed circuit board part and the extension part.