# US 2008/0186245 A1 · Rfid Tag Having a Folded Dipole > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2008/0186245 A1 - Document ID: US20080186245A1 - Status: Published application - Kind: A1 - Application number: 11/574,237 - Filed: 2005-08-16 - Published: 2008-08-07 - Earliest claimed: 2004-08-26 - Assignees: Koninklijke Philips Electronics N.V. - Inventors: Achim Hilgers - Web page: https://patentgrep.com/patent/US20080186245A1 ## CPC - H01Q 1/22: by structural association with other equipment or articles - G06K 19/07749: {the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card} - Y10T 29/49016: Antenna or wave energy "plumbing" making - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A circuit array, comprising a substrate (101), and comprising an electrically conducting folded dipole antenna (103) arranged on and/or in the substrate (101), the folded dipole antenna (103) having a first antenna connection (104) and having a second antenna connection (105), and wherein the folded dipole antenna (103) has a disconnected portion (108) dividing the folded dipole antenna (103) in a first antenna portion (109) and in a second antenna portion (110) such that a capacity (111) is formed at the disconnected portion (108) between the first antenna portion (109) and the second antenna portion (110), wherein an integrated circuit (102) can be or is arranged on the substrate (101), the integrated circuit (102) having a first integrated circuit connection (106) connected to the first antenna connection (104) and having a second integrated circuit connection (107) connected to the second antenna connection (105). ## Claims ### Claim 1 A circuit array, comprising a substrate; and comprising an electrically conducting folded dipole antenna arranged on and/or in the substrate, the folded dipole antenna having a first antenna connection and having a second antenna connection; wherein the folded dipole antenna has a disconnected portion dividing the folded dipole antenna in a first antenna portion and in a second antenna portion such that a capacity is formed at the disconnected portion between the first antenna portion and the second antenna portion. ### Claim 2 (depends on 1) The circuit array according to claim 1, comprising dielectric material between the first antenna portion and the second antenna portion. ### Claim 3 (depends on 1) The circuit array according to claim 1, comprising a capacitor device arranged in the disconnected portion the capacitor device having a first capacitor connection connected to the first antenna portion and having a second capacitor connection connected to the second antenna portion. ### Claim 4 (depends on 1) The circuit array according to claim 1, wherein the capacity is formed in a portion in which the first antenna portion overlaps the second antenna portion being arranged at a distance from one another. ### Claim 5 (depends on 4) The circuit array according to claim 4, wherein the first antenna portion overlaps the second antenna portion such that the disconnected portion is located above an overlapping part of the first antenna portion and below an overlapping part of the second antenna portion. ### Claim 6 (depends on 4) The circuit array according to claim 4, wherein the first antenna portion overlaps the second antenna portion in a plane parallel to a main surface of the substrate. ### Claim 7 (depends on 6) The circuit array according to claim 6, wherein the disconnected portion essentially has the shape of a line or a meander or a spiral. ### Claim 8 (depends on 7) The circuit array according to claim 7, having a floating structure made of an electrically conducting material arranged above or below the disconnected portion. ### Claim 9 (depends on 8) The circuit array according to claim 8, wherein the disconnected portion is provided at such a position of the folded dipole antenna that the first antenna portion is arranged symmetrically to the second antenna portion. ### Claim 10 (depends on 9) The circuit array according to claim 9, wherein the first antenna portion is provided U-shaped, and wherein the second antenna portion is provided U-shaped. ### Claim 11 (depends on 1) The circuit array according to claim 1, comprising an integrated circuit arranged on and/or in the substrate, the integrated circuit having a first integrated circuit connection connected to the first antenna connection and having a second integrated circuit connection connected to the second antenna connection. ### Claim 12 (depends on 11) The circuit array according to claim 11, wherein the integrated circuit comprises a rectifier sub-circuit adapted and connected such that the rectifier sub-circuit rectifies an alternating voltage provided in the folded dipole antenna to generate a direct voltage. ### Claim 13 (depends on 12) The circuit array according to claim 12, wherein the first antenna portion comprises a first leg piece and a second leg piece and one link piece, wherein the first leg piece is connected to the second leg piece by the link piece wherein the first leg piece is further connected to the first integrated circuit connection wherein the second antenna portion comprises a first leg piece and a second leg piece and one link piece wherein the first leg piece is connected to the second leg piece by the link piece wherein the first leg piece is further connected to the second integrated circuit connection wherein the second leg piece of the first antenna portion is separated from the second leg piece of the second antenna portion by the disconnected portion. ### Claim 14 (depends on 13) The circuit array according to claim 13, wherein the first and second leg pieces of the first and second antenna portions are aligned in a first direction being perpendicular to a second direction along which the link pieces of the first and second antenna portions are aligned. ### Claim 15 (depends on 14) The circuit array according to claim 14, wherein the material and/or the dimensions of the folded dipole antenna is/are configured such that the value of the impedance of the folded dipole antenna essentially equals the complex conjugate of the impedance of the integrated circuit. ### Claim 16 (depends on 15) The circuit array according to claim 15, configured as a radio frequency identification tag. ### Claim 17 (depends on 16) The circuit array according to claim 16, comprising at least one electronic member at the disconnected portion adapted such that the at least one electronic member regulates the impedance of the folded dipole antenna such that the value of the impedance of the folded dipole antenna essentially equals the complex conjugate of the impedance of the integrated circuit. ### Claim 18 A method of manufacturing a circuit array, wherein the method comprises the steps of forming an electrically conducting folded dipole antenna on and/or in a substrate the folded dipole antenna is formed to have a first antenna connection and to have a second antenna connection and the folded dipole antenna is formed to have a disconnected portion dividing the folded dipole antenna in a first antenna portion and in a second antenna portion such that a capacity is formed at the disconnected portion between the first antenna portion and the second antenna portion. ### Claim 19 (depends on 18) The method according to claim 18, wherein an integrated circuit is connected to the folded dipole antenna the integrated circuit having a first integrated circuit connection which is connected to the first antenna connection and having a second integrated circuit connection which is connected to the second antenna connection. ### Claim 20 (depends on 19) The method according to claim 19, wherein the material and/or the dimensions of the folded dipole antenna is/are configured such that the value of the impedance of the folded dipole antenna essentially equals to the complex conjugate of the impedance of the integrated circuit. ### Claim 21 (depends on 20) The method according to claim 20, wherein the value of the impedance of the folded dipole antenna is made essentially equal to the complex conjugate of the impedance of the integrated circuit by adjusting the width of the folded dipole antenna. ### Claim 22 (depends on 20) The method according to claim 20, wherein the value of the impedance of the folded dipole antenna is made essentially equal to the complex conjugate of the impedance of the integrated circuit by adjusting the length of a least a portion of the folded dipole antenna. ### Claim 23 (depends on 22) The method according to claim 22, wherein the value of the impedance of the folded dipole antenna is made essentially equal to the complex conjugate of the impedance of the integrated circuit by adjusting the distance between different portions of the folded dipole antenna. ### Claim 24 (depends on 23) The method according to claim 23, wherein the material and/or the dimensions of the substrate is/are configured such that the value of the impedance of the folded dipole antenna essentially equals to the complex conjugate of the impedance of the integrated circuit.