# US 2008/0185714 A1 · Methods of forming channels on an integrated circuit die and die cooling systems including such channels

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- Number: US 2008/0185714 A1
- Document ID: US20080185714A1
- Status: Published application
- Kind: A1
- Application number: 12/080,682
- Filed: 2008-04-04
- Published: 2008-08-07
- Earliest claimed: 2004-03-24
- Assignees: Intel Corporation
- Inventors: Shriram Ramanathan; Chin Chang Cheng; Alan M. Myers
- Web page: https://patentgrep.com/patent/US20080185714A1

## CPC

- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 70/682: {comprising holes having chips therein}
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method of forming channels on a die or other substrate. Also disclosed are liquid cooling systems including such channels.

## Claims

### Claim at position 1

1-25. (canceled)

### Claim 26

A device comprising:
an integrated circuit die; and
a cooling system coupled with the die, the cooling system comprising
a number of channels disposed over a surface of the die,
a barrier disposed on the die surface, the barrier extending about a periphery of the die and defining an interior region including the channels,
an inlet reservoir within the interior region of the barrier, the inlet reservoir in fluid communication with at least some of the channels, and
an outlet reservoir within the interior region of the barrier, the outlet reservoir in fluid communication with at least some of the channels.

### Claim 27 (depends on 26)

The device of claim 26, further comprising a cover plate coupled with the die, the cover plate extending over the barrier and the interior region, the cover plate including a first aperture in fluid communication with the inlet reservoir and a second aperture in fluid communication with the outlet reservoir.

### Claim 28 (depends on 27)

The device of claim 27, further comprising:
a first fluidic connection coupled with the first aperture and the inlet reservoir; and
a second fluidic connection coupled with the second aperture and the outlet reservoir.

### Claim 29 (depends on 26)

The device of claim 26, wherein the channels are formed from a material comprising copper.

### Claim at position 6

30-41. (canceled)