# US 2008/0185707 A1 · Semiconductor package structure and method for manufacturing the same

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- Number: US 2008/0185707 A1
- Document ID: US20080185707A1
- Status: Published application
- Kind: A1
- Application number: 12/062,203
- Filed: 2008-04-03
- Published: 2008-08-07
- Earliest claimed: 2005-03-02
- Assignees: Advanced Semiconductor Engineering, Inc.
- Inventors: Kuo Chung YEE
- Web page: https://patentgrep.com/patent/US20080185707A1

## CPC

- H10F 39/011: {Manufacture or treatment of image sensors covered by group H10F39/12}
- H10F 39/804: {Containers or encapsulations}
- H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80)
- H10W 74/129: {forming a chip-scale package [CSP]}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor package structure comprises a chip, a plurality of pad extension traces, a plurality of via holes, a lid and a plurality of metal traces, wherein the chip has an optical component and a plurality of pads disposed on its active surface; pad extension traces are electrically connected to the pads; the via holes penetrate the chip and are electrically connected to the pad extension traces and exposed out of side surfaces of the semiconductor package structure; the lid is adhered onto the active surface of the chip; and the plurality of metal traces is disposed on the back surface of the chip, electrically connected to the plurality of via holes, and used to define a plurality of solder pads thereon. The present invention also provides a method for manufacturing the semiconductor package structure.

## Claims

### Claim 1

A semiconductor package structure with at least one side surface, the semiconductor package structure comprising: a chip having an active surface, a back surface opposite to the active surface, a plurality of bonding pads disposed on the active surface, and an optical component disposed on the active surface and electrically connected to the chip; a plurality of via holes penetrating the chip and electrically connected to the plurality of bonding pads, wherein the via holes are exposed out of the side surface; a lid located on the active surface of the chip; and a plurality of metal traces being disposed on the back surface of the chip, electrically connected to the plurality of via holes, and defining a plurality of solder pads thereon.

### Claim 2 (depends on 1)

The semiconductor package structure as claimed in claim 1, further comprising a plurality of pad extension traces for connecting the via holes to the bonding pads.

### Claim 3 (depends on 1)

The semiconductor package structure as claimed in claim 1, further comprising a plurality of compliant pads disposed between the back surface of the chip and the metal traces and corresponding to the solder pads.

### Claim 4 (depends on 1)

The semiconductor package structure as claimed in claim 1, further comprising a solder mask, which covers the back surface of the chip and the metal traces with the solder pads exposed therefrom.

### Claim 5 (depends on 1)

The semiconductor package structure as claimed in claim 1, further comprising a plurality of solder balls respectively disposed on the solder pads.

### Claim 6 (depends on 1)

The semiconductor package structure as claimed in claim 1, wherein the lid is made of transparent material.

### Claim 7 (depends on 6)

The semiconductor package structure as claimed in claim 6, wherein the transparent material is selected form a group consisting of glass, acrylic resin and sapphire.

### Claim 8 (depends on 1)

The semiconductor package structure as claimed in claim 1, wherein the optical component is formed from complementary metal-oxide semiconductor (CMOS).

### Claim 9 (depends on 3)

The semiconductor package structure as claimed in claim 3, wherein the compliant pads are made of photosensitive benzocyclobutene polymer.

### Claim 10 (depends on 4)

The semiconductor package structure as claimed in claim 4, wherein the solder mask is made of photosensitive benzocyclobutene polymer.

### Claim at position 11

-20. (canceled)