# US 2008/0185701 A1 · Hermetically Sealed Package and Methods of Making the Same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2008/0185701 A1 - Document ID: US20080185701A1 - Status: Published application - Kind: A1 - Application number: 12/062,364 - Filed: 2008-04-03 - Published: 2008-08-07 - Earliest claimed: 2005-06-10 - Assignees: General Electric Company - Inventors: Donald Franklin Foust; William Francis Nealon - Web page: https://patentgrep.com/patent/US20080185701A1 ## CPC - H10K 50/8423: {Metallic sealing arrangements} - H10K 50/8426: {Peripheral sealing arrangements, e.g. adhesives, sealants} - H10K 50/841: {Self-supporting sealing arrangements} - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract Hermetically sealed packages having organic electronic devices are presented. A number of sealing mechanisms are provided to hermetically seal the package to protect the organic electronic device from environmental elements. A metal alloy sealant layer is employed proximate to the organic electronic device. Alternatively, a metal alloy sealant layer in combination with primer layer may also be implemented. Further, superstrates and edge wraps may be provided to completely surround the organic electronic device. ## Claims ### Claim 1 A hermetically sealed package comprising: a first substrate configured to receive an organic electronic device; an organic electronic device disposed on an upper surface of the substrate; and a superstrate disposed proximate to the organic electronic device, wherein the superstrate comprises a peripheral portion adapted to wrap around edges of the package such that the peripheral portion of the superstrate is coupled to a lower surface of the substrate opposite the organic electronic device. ### Claim 2 (depends on 1) The hermetically sealed package of claim 1, comprising a metal alloy sealant layer disposed on the lower surface of the substrate such that the peripheral portion of the superstrate is hermetically sealed to the lower surface of the substrate. ### Claim 3 (depends on 1) The hermetically sealed package of claim 1, comprising an insulating adhesive layer disposed between the organic electronic device and the superstrate. ### Claim 4 (depends on 1) The hermetically sealed package of claim 1, comprising a desiccant material disposed within pockets formed by wrapping the edges of the package with the superstrate. ### Claim 5 (depends on 1) The hermetically sealed package of claim 1, comprising a primer layer disposed between the metal alloy sealant layer and the lower surface of the substrate and between the metal alloy sealant layer and the peripheral portion of the superstrate. ### Claim 6 (depends on 5) The hermetically sealed package of claim 5, wherein the primer layer comprises tin. ### Claim 7 (depends on 1) The hermetically sealed package of claim 1, wherein the first substrate comprises a plastic, a metal foil, or a glass. ### Claim 8 (depends on 1) The hermetically sealed package of claim 1, comprising a barrier coating disposed between the first substrate and the organic electronic device. ### Claim 9 (depends on 1) The hermetically sealed package of claim 1, wherein the organic electronic device comprises an organic electroluminescent device or an organic photovoltaic device. ### Claim 10 (depends on 1) The hermetically sealed package of claim 1, wherein a melting point of the metal alloy sealant is configured to be greater than an operating temperature of the organic electronic device. ### Claim 11 (depends on 1) The hermetically sealed package of claim 1, wherein the metal alloy sealant layer comprises alloys of bismuth, or tin, or lead, or indium, or cadmium, or combinations thereof. ### Claim 12 (depends on 11) The hermetically sealed package of claim 11, wherein a volume percent of bismuth ranges from about 0 to about 50%, or a volume percent of tin ranges from about 5% to about 50%, or a volume percent of lead ranges from about 0 to about 50%, or a volume percent of indium ranges from about 0 to about 55%, or a volume percent of cadmium ranges from about 0 to about 15%. ### Claim 13 (depends on 1) The hermetically sealed package of claim 1, wherein the superstrate comprises a metal foil, a glass, or a plastic. ### Claim 14 A method of fabricating a hermetically sealed electronic package comprising: disposing a plurality of organic electronic devices on a substrate; attaching each of the organic electronic devices to the substrate; cutting the substrate into a plurality of individual units, each comprising an attached organic electronic device; and affixing a superstrate over each of the individual units, wherein the superstrate comprises a peripheral portion adapted to wrap around edges of the substrate such that the peripheral portion of the superstrate is coupled to a lower surface of the substrate opposite the organic electronic device. ### Claim 15 (depends on 14) The method of claim 14, comprising applying an insulating adhesive between the superstrate and the attached organic electronic device of each of the individual units prior to affixing the superstrate over each the individual units. ### Claim 16 (depends on 14) The method of claim 14, comprising applying a barrier layer to the substrate prior to disposing the organic electronic devices on the substrate. ### Claim 17 (depends on 14) The method of claim 14, comprising applying a metal sealant around the perimeter of each organic electronic device. ### Claim 18 (depends on 14) The method of claim 14, comprising affixing a metal alloy sealant layer on the lower surface of the substrate such that the peripheral portion of the superstrate is hermetically sealed to the lower surface of the substrate. ### Claim 19 (depends on 17) The method of claim 17, comprising affixing a primer layer over the substrate, the superstrate, or both to improve the adhesion to the metal alloy sealant layer. ### Claim 20 A hermetically sealed package comprising: a first substrate configured to receive an organic electronic device; an organic electronic device disposed on an upper surface of the substrate, wherein the organic electronic device comprises an organic electroluminescent device or an organic photovoltaic device; an insulating adhesive layer disposed above the organic electronic device; a superstrate coupled to the insulating adhesive layer and disposed proximate to the organic electronic device, wherein the superstrate comprises a peripheral portion adapted to wrap around edges of the package such that the peripheral portion of the superstrate is coupled to a lower surface of the substrate opposite the organic electronic device; and a metal alloy sealant layer disposed on the lower surface of the substrate such that the peripheral portion of the superstrate is hermetically sealed to the lower surface of the substrate.