# US 2008/0185673 A1 · Semiconductor Chip Module

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2008/0185673 A1
- Document ID: US20080185673A1
- Status: Published application
- Kind: A1
- Application number: 11/676,372
- Filed: 2007-02-19
- Published: 2008-08-07
- Earliest claimed: 2007-02-05
- Assignees: Infineon Technologies AG
- Inventors: Horst Theuss
- Web page: https://patentgrep.com/patent/US20080185673A1

## CPC

- G01P 1/023: {for acceleration measuring devices}
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- G01P: MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT (measuring or recording blood flow A61B5/02, A61B8/06; monitoring speed or deceleration of electrically-propelled vehicles B60L3/00; vehicle lighting systems adapted to indicate speed B60Q1/54; determining position or course in navigation, measuring ground distance in geodesy or surveying G01C; combined measuring devices for measuring two or more variables of movement G01C23/00; measuring velocity of sound G01H; measuring velocity of light G01J7/00; measuring direction or velocity of solid objects by reception or emission of radiowaves or other waves and based on propagation effects, e.g. Doppler effect, propagation time, direction of propagation, G01S; measuring speed of nuclear radiation G01T; measuring acceleration of gravity G01V; {measuring or recording the speed of trains B61L23/00; speed indicators incorporated in motor vehicles B60K35/00; measuring frequency or phase G01R; traffic control G08G})
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

One aspect includes a sensor chip module including a sensor chip and a module housing accommodating the sensor chip. The module housing defines a mounting plane of the sensor chip module. In one case, an active surface of the sensor chip is inclined with respect to the mounting plane of the sensor chip module.

## Claims

### Claim 1

A sensor chip module, comprising:
a sensor chip; and
a module housing accommodating the sensor chip, which module housing defines a mounting plane of the sensor chip module;
wherein an active surface of the sensor chip is inclined with respect to the mounting plane of the sensor chip module.

### Claim 2 (depends on 1)

The sensor chip module according to claim 1, further comprising a chip carrier, on which the sensor chip is applied.

### Claim 3 (depends on 2)

The sensor chip module according to claim 2, wherein the chip carrier is bent in order that the active surface of the sensor chip is inclined with respect to the mounting plane of the sensor chip module.

### Claim 4 (depends on 2)

The sensor chip module according to claim 2, wherein the chip carrier is a metallic leadframe carrier.

### Claim 5 (depends on 2)

The sensor chip module according to claim 2, wherein the chip carrier is a flexible plastic carrier with conductors metallized thereon.

### Claim 6 (depends on 1)

The sensor chip module according to claim 1, wherein the active surface of the sensor chip runs essentially perpendicular to the mounting plane of the sensor chip module.

### Claim 7 (depends on 1)

The sensor chip module according to claim 1, wherein the module housing is realized as an individual sensor chip housing accommodating the sensor chip.

### Claim 8 (depends on 2)

The sensor chip module according to claim 2, wherein a semiconductor chip is furthermore applied on the chip carrier.

### Claim 9 (depends on 8)

The sensor chip module according to claim 8, wherein the module housing comprises a sensor chip housing accommodating the sensor chip and a semiconductor chip housing accommodating the semiconductor chip.

### Claim 10 (depends on 7)

The sensor chip module according to claim 7, wherein the sensor chip housing is a hollow housing.

### Claim 11 (depends on 10)

The sensor chip module according to claim 10, wherein the sensor chip hollow housing is filled with a potting composition.

### Claim 12 (depends on 9)

The sensor chip module according to claim 9, wherein the semiconductor chip housing is a plastic injection-moulding housing realized by encapsulation of the semiconductor chip by injection moulding.

### Claim 13 (depends on 9)

The sensor chip module according to claim 9, wherein the sensor chip housing is a hollow housing and an opening of the sensor chip hollow housing is closed off by a wall of the semiconductor chip housing.

### Claim 14 (depends on 2)

The sensor chip module according to claim 2, wherein the chip carrier extends along an outer wall of the sensor chip housing.

### Claim 15 (depends on 14)

The sensor chip module according to claim 14, wherein the chip carrier forms an external contact-connection section in the region of the outer wall of the sensor chip housing.

### Claim 16 (depends on 1)

The sensor chip module according to claim 1, wherein the sensor chip is a motion sensor.

### Claim 17 (depends on 9)

The sensor chip module according to claim 9, wherein the semiconductor chip has a signal evaluation circuit for the signal evaluation of sensor signals and/or a driver circuit for driving the sensor chip and/or a logic circuit.

### Claim 18

A module, comprising:
a first semiconductor chip having an active surface, which is accommodated in a first housing;
a second semiconductor chip having an active surface, which is accommodated in a second housing; and
a common chip carrier, on which the first semiconductor chip and the second semiconductor chip are applied;
wherein the two housings are joined together to form a common module housing and the chip carrier is bent in such a way that the active surface of the first semiconductor chip is inclined with respect to the active surface of the second semiconductor chip.

### Claim 19 (depends on 18)

The module according to claim 18, wherein the first semiconductor chip is a sensor chip and/or an optical chip.

### Claim 20 (depends on 18)

The module according to claim 18, wherein the chip carrier is a metallic leadframe carrier.

### Claim 21 (depends on 18)

The module according to claim 18, wherein the chip carrier is a flexible plastic carrier with conductors metallized thereon.

### Claim 22 (depends on 18)

The module according to claim 18, wherein the second semiconductor chip has a signal evaluation circuit for the signal evaluation of signals of the first semiconductor chip and/or a driver circuit for driving the first semiconductor chip and/or a logic circuit.

### Claim 23

A method for producing a sensor module, comprising:
producing a sensor chip housing with sensor chip accommodated therein;
applying the sensor chip on a chip carrier; and
bending the chip carrier into a mounting plane of the sensor chip housing such that an active surface of the sensor chip is inclined with respect to the mounting plane of the sensor chip housing.

### Claim 24 (depends on 23)

The method according to claim 23, wherein firstly the sensor chip housing is fitted to the chip carrier and then the sensor chip is applied to the chip carrier.

### Claim 25 (depends on 24)

The method according to claim 24, wherein the sensor chip housing is potted with a potting composition after the application of the sensor chip to the chip carrier.

### Claim 26 (depends on 23)

The method according to claim 23, wherein a semiconductor chip is applied to the chip carrier.

### Claim 27 (depends on 26)

The method according to claim 26, wherein a semiconductor chip housing accommodating the semiconductor chip is fitted to the chip carrier.

### Claim 28 (depends on 27)

The method according to claim 27, wherein, as a result of the bending of the chip carrier, an opening of the sensor chip housing is caused to bear against the wall of the semiconductor chip housing and is closed off by said wall.

### Claim 29 (depends on 23)

The method according to claims 23, wherein the bending of the chip carrier is effected outside the sensor chip housing.

### Claim 30

A method for producing a module, comprising:
producing a first housing with a first semiconductor chip accommodated therein, said semiconductor chip being applied on a chip carrier;
producing a second housing with a second semiconductor chip accommodated therein, said semiconductor chip being applied on the chip carrier, and
bending the chip carrier in the region between the first housing and the second housing in order to join the first housing together with the second housing to form a common module housing.

### Claim 31 (depends on 30)

The method according to claim 30, wherein, as a result of the bending of the chip carrier an active surface of the first semiconductor chip is inclined with respect to the mounting area of the common module housing.