# US 2008/0185603 A1 · Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2008/0185603 A1 - Document ID: US20080185603A1 - Status: Published application - Kind: A1 - Application number: 11/968,763 - Filed: 2008-01-03 - Published: 2008-08-07 - Earliest claimed: 2007-02-05 - Assignees: Matsushita Electric Industrial Co., Ltd. - Inventors: Kiyokazu Itoi; Toshiyuki Fukuda; Yoshiki Takayama; Tetsushi Nishio; Tetsumasa Maruo - Web page: https://patentgrep.com/patent/US20080185603A1 ## CPC - A61B 1/05: characterised by the image sensor, e.g. camera, being in the distal end portion - H04N 23/51: Housings - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H10F 39/804: {Containers or encapsulations} - H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80) - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 72/0198: {batch processes} - H10F 39/026: {Wafer-level processing} - H10F 39/811: {Interconnections} - H10H 20/8506: {Containers} - H10H 20/853: characterised by their shape - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/10: characterised by their shape or disposition - A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D) - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An optical device is equipped with a light receiving region 16a and a peripheral circuit region 22 located around the light receiving region 16a on a major surface of an light receiving element 11a; electrodes for external connection 15 electrically connected to the peripheral circuit region 22 formed on a back surface opposite to the major surface of the light receiving element 11a; a transparent member 12 covering the light receiving region 16a adhered on the major surface of the light receiving element 11a with a light-transmitting adhesive 13; and a molding resin 14 for coating side surfaces of the transparent member 12 and the major surface of the light receiving element 11a excluding the region covered with the transparent member 12. ## Claims ### Claim 1 An optical device comprising one of a light receiving region and a light emitting region, and a peripheral circuit region located around one of the light receiving region and the light emitting region formed on a major surface of an optical element; electrodes for external connection electrically connected to the peripheral circuit region formed on a back surface opposite to the major surface of the optical element; a light-transmitting member covering one of the light receiving region and the light emitting region adhered with a light-transmitting adhesive on the major surface of the optical element; and a molding resin for coating side surfaces of the light-transmitting member and the major surface of the optical element excluding the region covered with the light-transmitting member. ### Claim 2 (depends on 1) The optical device according to claim 1 wherein a step is formed on the side surfaces of the light-transmitting member. ### Claim 3 (depends on 1) The optical device according to claim 1 wherein the side surfaces of the light-transmitting member are slanted. ### Claim 4 (depends on 1) The optical device according to claim 1 wherein an upper surface of the molding resin is as high as or higher than an upper surface of the light-transmitting member. ### Claim 5 (depends on 1) The optical device according to claim 1 wherein the optical element is one of a solid-state image element, a photo IC, an LED, and a laser. ### Claim 6 (depends on 1) A camera module equipped with the optical device according to claim 1 wherein the optical element is one of a solid-state image element, and a photo IC. ### Claim 7 (depends on 5) An endoscope module equipped with the optical device according to claim 5. ### Claim 8 A method for manufacturing an optical device comprising the steps of preparing an optical element wafer wherein a plurality of optical elements are vertically and horizontally arranged each having one of a light receiving region and a light emitting region, and a peripheral circuit region located around one of the light receiving region and the light emitting region on a major surface, and electrodes for external connection electrically connected to the peripheral circuit region formed on a back surface opposite to the major surface of the optical element; adhering a light-transparent member on one of each light receiving region and light emitting region in the optical element wafer using a light-transmitting adhesive; coating side surfaces of the light-transmitting member and a major surface of the optical element wafer with a molding resin while allowing release sheets to intervene between a mold surface and upper and lower surfaces of the optical element wafer, and clamping the system to fabricate an optical device wafer; and dividing the optical device wafer removed out of the mold into individual devices. ### Claim 9 A method for manufacturing an optical device comprising the steps of preparing an optical element wafer wherein a plurality of optical elements are vertically and horizontally arranged each having one of a light receiving region and a light emitting region, and a peripheral circuit region located around one of the light receiving region and the light emitting region on a major surface, and electrodes for external connection electrically connected to the peripheral circuit region formed on a back surface opposite to the major surface of the optical element; adhering a light-transmitting member on one of each light receiving region and light emitting region in the optical element wafer using a light-transmitting adhesive; coating side surfaces of the light-transmitting member and a major surface of the optical element wafer with a molding resin by applying a liquid molding resin using screen printing to fabricate an optical device wafer; and dividing the optical device wafer into individual devices. ### Claim 10 (depends on 8) The method for manufacturing an optical device according to claim 8, wherein a surface protecting seal is adhered on a major surface of the light-transmitting member opposite to the optical element; and comprising the step of removing the surface protecting seal after the step of coating the side surfaces of the light-transmitting member and the major surface of the optical element wafer with the molding resin to fabricate the optical device wafer. ### Claim 11 (depends on 9) The method for manufacturing an optical device according to claim 9, wherein a surface protecting seal is adhered on a major surface of the light-transmitting member opposite to the optical element; and comprising the step of removing the surface protecting seal after the step of coating the side surfaces of the light-transmitting member and the major surface of the optical element wafer with the molding resin to fabricate the optical device wafer.