# US 2008/0185181 A1 · Alternating via fanout patterns > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2008/0185181 A1 - Document ID: US20080185181A1 - Status: Published application - Kind: A1 - Application number: 11/983,797 - Filed: 2007-11-08 - Published: 2008-08-07 - Earliest claimed: 2006-11-08 - Inventors: Charles L. Pfeil - Web page: https://patentgrep.com/patent/US20080185181A1 ## CPC - H05K 1/114: {Pad being close to via, but not surrounding the via} - H05K 3/429: {Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers} - H05K 2201/09227: Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting - H05K 2201/09509: Blind vias, i.e. vias having one side closed - H05K 2201/09536: Buried plated through-holes, i.e. plated through-holes formed in a core before lamination - H05K 2201/10734: Ball grid array [BGA]; Bump grid array - Y10T 29/49147: Assembling terminal to base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Various techniques are disclosed for identifying different fanout via configurations that can be created using fanout vias, and then arranging those fanout via configurations in an alternating manner in order to increase the amount and/or area of routing channels available to route traces to the fanout vias. According to some of these techniques, a first fanout via configuration is selected, which can connect a component pin to a first layer of a multilayer printed circuit board. Next, a second fanout via configuration is selected, which can connect a component pin to a second layer of a multilayer printed circuit board different from the first layer. When the printed circuit board is designed, lines of these vias configurations are formed to correspond to a component that will be mounted on the printed circuit board. Each line will have a series of the first fanout via configuration alternating with a series of the second fanout via configuration. Further, two or more fanout via configurations of the same type can be arranged into a via configuration model. A printed circuit board design may then have lines of different via configuration models, such that each line has a series of one type of fanout via configuration model alternating with a series of another type of via fanout configuration model. Alternately or additionally, yet another type of fanout via configuration may be identified. Fanout via configurations of this other type may then be placed along a diagonal line bisecting the area of a printed circuit board design corresponding to the location at which a component will be mounted, in order to preserve routing channel area along the diagonal line. ## Claims ### Claim 1 A method of creating a printed circuit board, comprising: selecting a first fanout via configuration which can connect a component pin to a first layer of a multilayer printed circuit board; selecting a second fanout via configuration, which can connect a component pin to a second layer of a multilayer printed circuit board different from the first layer; and adding a line of fanout via configurations to a printed circuit board design, such that the line of fanout via configurations includes a series of instances of the first fanout via configuration alternated with a series of instances of the second fanout via configuration. ### Claim 2 (depends on 1) The method recited in claim 1, wherein multiple instances of the first fanout via configuration are organized into at least one instance of a fanout via configuration model. ### Claim 3 (depends on 2) The method recited in claim 2, wherein multiple instances of the second fanout via configuration are organized into at least one instance of a second fanout via configuration model. ### Claim 4 (depends on 1) The method recited in claim 1, wherein multiple instances of the second fanout via configuration are organized into at least one instance of a fanout via configuration model. ### Claim 5 (depends on 1) The method recited in claim 1, further comprising: selecting a third fanout via configuration; and adding a plurality of instances of the third fanout via configuration along a diagonal line extending between opposite corners of a pin array in the printed circuit board design. ### Claim 6 (depends on 1) A printed circuit board manufactured according to the method recited in claim 1. ### Claim 7 A method of creating a printed circuit board, comprising: selecting a fanout via configuration having a trace and a via; and adding a plurality of instances of the fanout via configuration along a diagonal line extending between opposite corners of a pin array in a printed circuit board design, such that the trace in each instance of the fanout via configuration extends away from the diagonal line. ### Claim 8 (depends on 7) The method recited in claim 7, wherein the trace in each instance of the fanout via configuration extends in a direction substantially orthogonal to the diagonal line. ### Claim 9 (depends on 7) A printed circuit board manufactured according to the method recited in claim 7.