# US 2008/0185172 A1 · Printed wiring board and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2008/0185172 A1 - Document ID: US20080185172A1 - Status: Published application - Kind: A1 - Application number: 11/844,788 - Filed: 2007-08-24 - Published: 2008-08-07 - Earliest claimed: 2007-02-06 - Assignees: Ibiden Co., Ltd. - Inventors: Michimasa Takahashi; Yukinobu Mikado; Hiroyuki Yanagisawa - Web page: https://patentgrep.com/patent/US20080185172A1 ## CPC - H05K 1/167: {incorporating printed resistors} - H05K 3/205: {using a pattern electroplated or electroformed on a metallic carrier} - H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)} - H05K 2201/0376: Flush conductors, i.e. flush with the surface of the printed circuit - H05K 2201/09736: Varying thickness of a single conductor; Conductors in the same plane having different thicknesses - H05K 2203/1453: Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors - Y10T 29/49117: Conductor or circuit manufacturing - Y10T 29/49126: Assembling bases - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - Y10T 29/49155: Manufacturing circuit on or in base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A printed wiring board includes an insulation layer having a surface, electrodes embedded in the insulation layer, a resistor formed on the surface of the insulation layer and electrically connected to the electrodes, and an external connection conductive pattern formed over the surface of the insulation layer and electrically connected to one or more electrodes. The insulation layer and the electrodes form a component-mounting surface on the surface of the insulation layer, the component-mounting surface is substantially leveled with the surface of the insulation layer and includes a resistor forming region on which the resistor is formed, and the external connection conductive pattern is separated by a space from the resistor. ## Claims ### Claim 1 A printed wiring board comprising: an insulation layer having a surface; a plurality of electrodes embedded in the insulation layer; a resistor formed on the surface of the insulation layer and electrically connected to the electrodes; and an external connection conductive pattern formed over the surface of the insulation layer and electrically connected to at least one of the electrodes, wherein the insulation layer and the electrodes form a component-mounting surface on the surface of the insulation layer, the component-mounting surface is substantially leveled with the surface of the insulation layer and includes a resistor forming region on which the resistor is formed, and the external connection conductive pattern is separated by a space from the resistor. ### Claim 2 (depends on 1) The printed wiring board according to claim 1, further comprising a second insulation layer embedding the resistor and the external connection conductive pattern. ### Claim 3 (depends on 2) The printed wiring board according to claim 2, wherein the second insulation layer contains fibers or inorganic fillers. ### Claim 4 (depends on 3) The printed wiring board according to claim 3, wherein the fibers or the inorganic fillers comprise glass. ### Claim 5 (depends on 1) The printed wiring board according to claim 1, wherein the electrodes comprise a metal and a contained element. ### Claim 6 (depends on 5) The printed wiring board according to claim 5, wherein the metal of the electrodes comprises nickel. ### Claim 7 (depends on 5) The printed wiring board according to claim 5, wherein the contained element comprises phosphorus. ### Claim 8 (depends on 6) The printed wiring board according to claim 6, wherein the contained element comprises phosphorus and the phosphorus is contained in the nickel in an approximate range of 9 to 11 wt. pct. ### Claim 9 (depends on 1) The printed wiring board according to claim 1, wherein the resistor has a thickness which is set to be less than a thickness of the external connection conductive pattern. ### Claim 10 (depends on 9) The printed wiring board according to claim 9, wherein the external connection conductive pattern comprises a metal foil and a metal plating which is applied on the surface of the insulation layer where the metal foil is not in contact with the insulation layer. ### Claim 11 (depends on 10) The printed wiring board according to claim 10, wherein the metal plating comprises copper. ### Claim 12 (depends on 9) The printed wiring board according to claim 9, wherein the electrodes has a thickness which is set to be less than a thickness of the external connection conductive pattern. ### Claim 13 (depends on 9) The printed wiring board according to claim 9, further comprising a second insulation layer embedding the resistor and the external connection conductive pattern. ### Claim 14 (depends on 9) The printed wiring board according to claim 9, wherein the external connection conductive pattern is formed on a portion of the surface of the insulation layer to which a black oxide treatment is applied. ### Claim 15 (depends on 9) The printed wiring board according to claim 9, further comprising a conductive interlayer connection via-hole structure formed in the second insulation layer and electrically connected to the external connection conductive pattern. ### Claim 16 (depends on 15) The printed wiring board according to claim 15, wherein the conductive interlayer connection via-hole structure is filled with a conductive resin. ### Claim 17 (depends on 15) The printed wiring board according to claim 15, wherein the conductive interlayer connection via-hole structure is filled with a metal by plating. ### Claim 18 A printed wiring board comprising: an insulation layer having a surface; a plurality of electrodes embedded in the insulation layer; a resistor formed on the surface of the insulation layer and electrically connected to the electrodes; and an external connection conductive pattern formed over the surface of the insulation layer and electrically connected to at least of the electrodes, wherein the insulation layer and the electrodes form a component-mounting surface on the surface of the insulation layer, the component-mounting surface is substantially leveled with the surface of the insulation layer and includes a resistor forming region on which the resistor is formed, and the resistor has a thickness which is set to be less than a thickness of the external connection conductive pattern. ### Claim 19 (depends on 18) The printed wiring board according to claim 18, wherein the external connection conductive pattern is formed with a metal foil and a metal plating which is applied on the surface where the metal foil is not in contact with the insulation layer. ### Claim 20 (depends on 19) The printed wiring board according to claim 19, wherein the metal plating comprises copper. ### Claim 21 (depends on 18) The printed wiring board according to claim 18, wherein the electrodes have a thickness which is set to be less than a thickness of the external connection conductive pattern. ### Claim 22 (depends on 18) The printed wiring board according to claim 18, further comprising a second insulation layer embedding the resistor and the external connection conductive pattern. ### Claim 23 (depends on 22) The printed wiring board according to claim 22, wherein the external connection conductive pattern is formed on a portion of the surface of the insulation layer to which a black oxide treatment is applied. ### Claim 24 (depends on 22) The printed wiring board according to claim 22, further comprising a conductive interlayer connection via-hole structure formed in the second insulation layer and electrically connected to the external connection conductive pattern. ### Claim 25 (depends on 24) The printed wiring board according to claim 24, wherein the conductive interlayer connection via-hole structure is filled with a conductive resin. ### Claim 26 (depends on 24) The printed wiring board according to claim 24, wherein the conductive interlayer connection via-hole structure is filled with a metal by plating. ### Claim 27 A manufacturing method of a printed wiring board, comprising: forming a plurality of electrodes on a conductive layer formed on a substrate by a plating method; forming an insulation layer on the electrodes and the conductive layer; removing the substrate from the conductive layer; patterning the conductive layer except for a resistor forming region reserved for forming a resistor, thereby forming an external connection conductive pattern; and forming a resistor in the resistor forming region such that the resistor is separated by a space from the external connection conductive pattern. ### Claim 28 (depends on 27) The manufacturing method according to claim 27, wherein the forming of the resistor comprises forming the resistor by a printing method. ### Claim 29 (depends on 28) The manufacturing method according to claim 28, wherein the printing method is one of a screen printing method and an ink-jet method. ### Claim 30 (depends on 29) The manufacturing method according to claim 29, wherein the forming of the resistor comprises forming the resistor by the screen printing method using a carbon paste. ### Claim 31 (depends on 27) The manufacturing method according to claim 27, wherein the forming of the electrodes comprises forming the electrodes comprising a metal and a contained element. ### Claim 32 (depends on 27) The manufacturing method according to claim 27, wherein the forming of the electrodes comprises forming the electrodes comprising nickel and a contained element. ### Claim 33 (depends on 31) The manufacturing method according to claim 31, wherein the contained element comprises phosphorus. ### Claim 34 (depends on 32) The manufacturing method according to claim 32, wherein the nickel contains the phosphorus in a content of approximately 9 to 11 wt. pct. ### Claim 35 (depends on 27) The manufacturing method according to claim 27, further comprising applying a black oxide treatment to a portion of the surface of the insulation layer in which the external connection conductive pattern is formed. ### Claim 36 (depends on 27) The manufacturing method according to claim 27, wherein the forming of the resistor comprises setting a thickness of the resistor to be thinner than a thickness of the conductive layer.