# US 2008/0184550 A1 · Method for manufacturing integrated circuit device having antenna conductors > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2008/0184550 A1 - Document ID: US20080184550A1 - Status: Published application - Kind: A1 - Application number: 12/026,309 - Filed: 2008-02-05 - Published: 2008-08-07 - Earliest claimed: 2007-02-06 - Assignees: Mutual-Pak Technology Co., Ltd. - Inventors: Lu-Chen Hwan; P.C. Chen; Yu-Lin Ma - Web page: https://patentgrep.com/patent/US20080184550A1 ## CPC - H01Q 23/00: Antennas with active circuits or circuit elements integrated within them or attached to them - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 44/501: {Inductive arrangements (H10W44/20 takes precedence)} - H10W 44/248: {for antennas} - Y10T 29/49016: Antenna or wave energy "plumbing" making - Y10T 29/49018: with other electrical component - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - Y10T 29/49144: by metal fusion - Y10T 29/49146: with encapsulating, e.g., potting, etc. - Y10T 29/49147: Assembling terminal to base - Y10T 29/49155: Manufacturing circuit on or in base - Y10T 29/49169: Assembling electrical component directly to terminal or elongated conductor - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A method for manufacturing an integrated circuit device having antenna conductors is provided. The method includes the steps of providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circuit component; forming a plurality of metal bumps above the first antenna conductor; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; removing a portion of the insulating layer to expose a top portion of each metal bump; and forming a second antenna conductor on the insulating layer by screen printing. ## Claims ### Claim 1 A method for manufacturing an integrated circuit device having antenna conductors, the method comprising the steps of: providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circuit component; forming a plurality of metal bumps above the first antenna conductor by screen-printing; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; removing a portion of the insulating layer to expose a top portion of each metal bump; and forming a second antenna conductor on the insulating layer by screen printing. ### Claim 2 (depends on 1) The method according to claim 1, wherein the first antenna conductor has a first end and a second end connected to a first electrode and a second electrode of the integrated circuit device respectively, and the first antenna conductor is formed as a loop around the second end. ### Claim 3 (depends on 2) The method according to claim 2, wherein the first end is formed with a bottom surface larger than an upper surface of the first electrode. ### Claim 4 (depends on 2) The method according to claim 2, further comprising forming a first conductive joint on the surface of each integrated circuit by screen-printing, wherein the first conductive joint is connected to the second electrode. ### Claim 5 (depends on 4) The method according to claim 4, wherein the first conductive joint is formed with a bottom surface larger than an upper surface of the second electrode. ### Claim 6 (depends on 4) The method according to claim 4, wherein the second end is positioned between the first conductive joint and the first end. ### Claim 7 (depends on 4) The method according to claim 4, wherein the plurality of metal bumps are positioned on the first end, the second end, and the first conductive joint. ### Claim 8 (depends on 4) The method according to claim 4, wherein the second antenna conductor has a third end corresponding to the second electrode, and the third end is connected to the first conductive joint through one of the plurality of metal bumps. ### Claim 9 (depends on 4) The method according to claim 4, wherein the second antenna conductor has a fourth end corresponding to the second end, and the fourth end is connected to the second end through one of the plurality of metal bumps. ### Claim 10 (depends on 2) The method according to claim 2, further comprising forming a second conductive joint corresponding to the first electrode by screen-printing, wherein the second conductive joint is electrically connected to the first end through one of the plurality of metal bumps. ### Claim 11 (depends on 9) The method according to claim 9, wherein the second antenna conductor is formed as a loop around the fourth end. ### Claim 12 (depends on 1) The method according to claim 1, further comprising cutting the wafer to form a plurality of integrated circuit chips, wherein each integrated circuit chip is packaged and is separated from each other. ### Claim 13 (depends on 1) The method according to claim 1, further comprising forming a protective layer on the surface of the second antenna conductor. ### Claim 14 (depends on 13) The method according to claim 13, wherein the protective layer is made by a material selected from the group consisting of Ni, Au, and the combination thereof. ### Claim 15 A method for manufacturing an integrated circuit device having antenna conductors, the method comprising the steps of: providing a wafer with a plurality of integrated circuit components, wherein each integrated circuit component on its surface includes a dielectric layer and an electrode embedded in the dielectric layer; forming an antenna conductor having a first end and a second end on the surface; forming a plurality of metal bumps respectively positioned on the first end and the second end by screen-printing; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; and removing a portion of the insulating layer to expose a top portion of each metal bump. ### Claim 16 (depends on 15) The method according to claim 15, wherein the first end is connected to the electrode, and the antenna conductor is formed as a loop around the second end. ### Claim 17 (depends on 15) The method according to claim 15, further comprising cutting the wafer to form a plurality of integrated circuit chips, wherein each integrated circuit chip is packaged and is separated from each other. ### Claim 18 (depends on 16) The method according to claim 16, wherein the first end of the antenna conductor is formed with a bottom surface larger an upper surface of the electrode.