Implantable devices and methods of forming the same
AssigneeCornova, Inc.
InventorsS. Eric Ryan, Richard Sahagian
Life of this patent
Estimating the term…
Abstract
An implantable device and method of forming the same comprises a substrate, an adhesion layer, and a capping layer. The adhesion layer comprises a portion with a predominant proportion of palladium, the portion of the predominant proportion of palladium directly on the substrate. The capping layer comprises a capping layer material, and is on the adhesion layer.
Claims72
An implantable device comprising:
- a substrate;
- an adhesion layer comprising a portion with a predominant proportion of palladium, the portion of the adhesion layer with a predominant proportion of palladium directly on the substrate;
- and
- a capping layer comprising a capping layer material, the capping layer on the adhesion layer.
An implantable device comprising:
- a substrate;
- an adhesion layer comprising a portion with a predominant proportion of gold, the portion of the adhesion layer with a predominant proportion of gold directly on the substrate;
- and
- a capping layer comprising a capping layer material, the capping layer on the adhesion layer, wherein the adhesion layer between the substrate and the capping layer has a thickness of less than about 5000 angstroms.
A method of providing a surface on an implantable device comprising:
- providing a substrate of the implantable device;
- providing an adhesion layer comprising a portion with a predominant proportion of palladium directly on the substrate by simultaneously directing a flux of palladium atoms and a flux of bombarding ions toward the substrate;
- and
- providing a capping layer comprising a capping layer material on the adhesion layer by directing a flux of capping layer material atoms and a flux of bombarding ions toward the provided adhesion layer.
A method of providing a surface on an implantable device comprising:
- providing a substrate of the implantable device;
- providing an adhesion layer comprising a portion having a predominant proportion of gold directly on the substrate by simultaneously directing a flux of gold atoms and a flux of bombarding ions toward the substrate;
- and
- providing a capping layer comprising a capping layer material on the adhesion layer by directing a flux of capping layer material atoms and a flux of bombarding ions toward the provided adhesion layer, the adhesion layer between the substrate and the capping layer having a thickness of less than about 5000 angstroms.
An implantable device comprising:
- a substrate;
- and
- a coating directly on the substrate, the coating comprising a capping layer of essentially platinum, wherein the coating has a thickness of less than about 15,000 angstroms.
A method of providing a surface on an implantable device comprising:
- providing a substrate;
- and
- forming a coating directly on the substrate, the coating comprising a capping layer of essentially platinum, wherein the coating has a thickness of less than about 15,000 angstroms.
Dependencies are inferred from the claim text.