Adhesive compositions for bonding and filling large assemblies
AssigneeIPS Corporation
InventorsSamuel B. Osae, Paul C. Briggs
Life of this patent
Estimating the term…
Abstract
Adhesive composition for bonding and filling large assemblies, including a mixture of about 5 percent to about 75 percent by weight of a thermoplastic polymer, about 0.5 percent to about 35 percent by weight of a polyester resin or vinyl ester resin, and about 20 percent to about 80 percent by weight of an alkyl acrylate or methacrylate monomer.
Claims25
A polymerizable adhesive or filling composition for large assemblies comprising from about 5 to about 75 percent, by weight, of a thermoplastic or partially thermoplastic polymer or elastomer, from about 0.5 to about 35 percent, by weight, of a dicyclopentadiene resin and about 20 to about 80 percent of an alkyl acrylate or methacrylate monomer, wherein the thermoplastic or partially thermoplastic polymer or elastomer is crosslinked or partially crosslinked.
A polymerizable adhesive or filling composition for large assemblies comprising from about 5 to about 75 percent, by weight, of a thermoplastic or partially thermoplastic polymer or elastomer, from about 0.5 to about 35 percent, by weight, of a dicyclopentadiene resin and about 20 to about 80 percent of an alkyl acrylate or methacrylate monomer, wherein the thermoplastic or partially thermoplastic polymer or elastomer is crosslinked or partially crosslinked, wherein at least one thermoplastic or partially thermoplastic polymer or elastomer is insoluble or only partially soluble in the monomer, wherein at least one thermoplastic or partially thermoplastic polymer or elastomer provides gel properties in the composition prior to curing, and wherein the thermoplastic or partially thermoplastic polymer or elastomer is selected from the group consisting of diene polymers or copolymers, acrylic polymers or copolymers and chlorinated polymers and mixtures thereof.
Dependencies are inferred from the claim text.